Method for stretching vapor deposition mask, method for producing frame-equipped vapor deposition mask, method for producing organic semiconductor element, and stretching apparatus

ABSTRACT

In a method for stretching a vapor deposition mask including a metal mask in which a slit is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the slit, a stretching assistance member is overlapped on one surface of the vapor deposition mask, the stretching assistance member is fixed to the vapor deposition mask in at least part of a portion in which the one surface of the vapor deposition mask and the stretching assistance member overlap with each other, and the vapor deposition mask fixed to the stretching assistance member is stretched by pulling the stretching assistance member fixed to the vapor deposition mask.

TECHNICAL FIELD

The present disclosure relate to a method for stretching a vapordeposition mask, a method for producing a frame-equipped vapordeposition mask, a method for producing an organic semiconductorelement, and a stretching apparatus.

BACKGROUND ART

With upsizing of the products using organic EL elements or increase insubstrate sizes, a demand for upsizing is also growing with respect tovapor deposition masks, and the metal plates for use in production ofthe vapor deposition masks constituted of metals are also upsized.However, with the present metal processing technique, it is difficult toform openings in a large metal plate with high precision, which cannotrespond to enhancement in definition of the openings. Moreover, in thecase of a vapor deposition mask constituted of only a metal, the massthereof also increases with upsizing, and the total mass including aframe also increases, which becomes a hindrance to handling.

Under such circumstances, in Patent Document 1, there is proposed avapor deposition mask including a metal mask in which slits are providedand a resin mask which is positioned on the surface of the metal maskand in which openings corresponding to a pattern to be produced by vapordeposition are arranged for a plurality of rows in the lengthwisedirection and in the crosswise direction, the metal mask and the resinmask being stacked. The vapor deposition mask proposed in PatentDocument 1 is regarded as being capable of satisfying both highdefinition and lightweight in upsizing, and moreover, forming a vapordeposition pattern with high definition.

CITATION LIST Patent Document

-   Patent Document 1: Japanese Patent No. 5288072

SUMMARY

A primary object of an embodiment of the present invention is to providea method for stretching a vapor deposition mask capable of stretching avapor deposition mask as disclosed in Patent Document 1 above in asimple method, a method for producing a frame-equipped vapor depositionmask using the stretching method, a method for producing an organicsemiconductor element using the vapor deposition mask, and a stretchingapparatus used for these methods.

There is provided a method for stretching a vapor deposition maskaccording to an embodiment of the present invention in order to solvethe aforementioned problem, the vapor deposition mask including a metalmask in which a slit is formed and a resin mask in which an openingcorresponding to a pattern to be produced by vapor deposition is formedat a position overlapping with the slit, the metal mask and the resinmask being stacked, the method including: a stretching assistance memberfixing step of overlapping a stretching assistance member on one surfaceof the vapor deposition mask and fixing the stretching assistance memberto the vapor deposition mask in at least part of a portion in which theone surface of the vapor deposition mask and the stretching assistancemember overlap with each other; and a first stretching step ofstretching the vapor deposition mask fixed to the stretching assistancemember by pulling the stretching assistance member fixed to the vapordeposition mask.

Moreover, in the aforementioned method for stretching a vapor depositionmask, the method may further include a second stretching step ofstretching the vapor deposition mask in a first direction before thefirst stretching step, and in the first stretching step, the vapordeposition mask fixed to the stretching assistance member may bestretched in a second direction different from the first direction bypulling the stretching assistance member fixed to the vapor depositionmask.

Moreover, there is provided a method for producing a frame-equippedvapor deposition mask according to an embodiment of the presentinvention in order to solve the aforementioned problem, the methodincluding: a preparing step of preparing a vapor deposition maskincluding a metal mask in which a slit is formed and a resin mask inwhich an opening corresponding to a pattern to be produced by vapordeposition is formed at a position overlapping with the slit, the metalmask and the resin mask being stacked; a stretching assistance memberfixing step of overlapping a stretching assistance member on one surfaceof the vapor deposition mask and fixing the stretching assistance memberto the vapor deposition mask in at least part of a portion in which theone surface of the vapor deposition mask and the stretching assistancemember overlap with each other; a first stretching step of stretchingthe vapor deposition mask fixed to the stretching assistance member bypulling the stretching assistance member fixed to the vapor depositionmask; and a frame fixing step of fixing the vapor deposition mask in astate of being stretched in the first stretching step to a frame inwhich a through hole is formed.

Moreover, in the aforementioned method for producing a frame-equippedvapor deposition mask, the method may further include a secondstretching step of stretching the vapor deposition mask in a firstdirection before the first stretching step, and in the first stretchingstep, the vapor deposition mask fixed to the stretching assistancemember may be stretched in a second direction different from the firstdirection by pulling the stretching assistance member fixed to the vapordeposition mask.

Moreover, in the aforementioned method for producing a frame-equippedvapor deposition mask, the frame-equipped vapor deposition mask may be aframe-equipped vapor deposition mask constituted by arranging and fixinga plurality of the vapor deposition masks to the frame, in a stage forproducing the frame-equipped vapor deposition mask, at least one vapordeposition mask of the plurality of vapor deposition masks may be fixedto the frame through the stretching assistance member fixing step, thefirst stretching step and the frame fixing step, and in the firststretching step, by pulling the stretching assistance member fixed tothe one vapor deposition mask, the one vapor deposition mask fixed tothe stretching assistance member may be stretched in a direction towarda vapor deposition mask adjacent to the one vapor deposition mask.

Moreover, in the aforementioned method for producing a frame-equippedvapor deposition mask, the method may further include a secondstretching step of stretching the one vapor deposition mask in adirection different from the direction toward the adjacent vapordeposition mask before the first stretching step is performed.

Moreover, there is provided a method for producing an organicsemiconductor element according to an embodiment of the presentinvention in order to solve the aforementioned problem, the methodincluding a step of forming a vapor deposition pattern on a vapordeposition target using a frame-equipped vapor deposition mask in whicha vapor deposition mask is fixed to a frame, wherein in the step offorming the vapor deposition pattern, the vapor deposition mask fixed tothe frame is a frame-equipped vapor deposition mask produced through thesteps including: a step of preparing the vapor deposition mask includinga metal mask in which a plurality of slits are formed and a resin maskin which openings corresponding to a pattern to be produced by vapordeposition are formed at a position overlapping with the slits, themetal mask and the resin mask being stacked; a stretching assistancemember fixing step of overlapping a stretching assistance member on onesurface of the vapor deposition mask and fixing the stretchingassistance member to the vapor deposition mask in at least part of aportion in which the one surface of the vapor deposition mask and thestretching assistance member overlap with each other; a first stretchingstep of stretching the vapor deposition mask fixed to the stretchingassistance member by pulling the stretching assistance member fixed tothe vapor deposition mask; and a frame fixing step of fixing the vapordeposition mask in a state of being stretched in the first stretchingstep to the frame in which a through hole is formed.

Moreover, there is provided a stretching apparatus for stretching avapor deposition mask according to an embodiment of the presentinvention in order to solve the aforementioned problem, the vapordeposition mask including a metal mask in which a slit is formed and aresin mask in which an opening corresponding to a pattern to be producedby vapor deposition is formed at a position overlapping with the slit,the metal mask and the resin mask being stacked, the apparatuscomprising: a stretching assistance member; and a driving device forpulling the stretching assistance member, wherein the stretchingassistance member is capable of being fixed in at least part of aportion overlapping with one surface of the vapor deposition mask whenoverlapped with the one surface of the vapor deposition mask.

ADVANTAGEOUS EFFECTS

According to the method for stretching a vapor deposition mask and thestretching apparatus of an embodiment of the present invention, a vapordeposition mask which satisfies both high definition and lightweight inupsizing can be stretched in a simple method. Moreover, according to themethod for producing a frame-equipped vapor deposition mask of anembodiment of the present invention, a frame-equipped vapor depositionmask capable of forming a vapor deposition pattern on a vapor depositiontarget with excellent precision can be obtained. Moreover, according tothe method for producing an organic semiconductor element of anembodiment of the present invention, organic semiconductor elementsexcellent in quality can be produced in excellent yield.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram exemplarily showing a vapor deposition mask preparedin a preparing step, portion (a) is an elevation view thereof as seenfrom a metal mask side and portion (b) is a cross-sectional view takenalong the line A-A in portion (a).

FIG. 2 is an elevation view of the vapor deposition mask of Embodiment(A) prepared in the preparing step as seen from the metal mask side.

FIG. 3 is an elevation view of the vapor deposition mask of Embodiment(A) prepared in the preparing step as seen from the metal mask side.

FIG. 4 is an elevation view of the vapor deposition mask of Embodiment(A) prepared in the preparing step as seen from the metal mask side.

FIG. 5 presents elevation views of the vapor deposition mask ofEmbodiment (A) prepared in the preparing step as seen from the metalmask side.

FIG. 6 is an elevation view of the vapor deposition mask of Embodiment(B) prepared in the preparing step as seen from the metal mask side.

FIG. 7 is an elevation view of the vapor deposition mask of Embodiment(B) prepared in the preparing step as seen from the metal mask side.

FIG. 8 presents diagrams for explaining a stretching assistance memberfixing step and presents elevation views of the vapor deposition masksas seen from the resin mask side.

FIG. 9 presents diagrams for explaining the stretching assistance memberfixing step and portions (a) to (e) are elevation views of the vapordeposition masks as seen from the resin mask side.

FIG. 10 presents diagrams for explaining a first stretching step andportions (a) to (c) are elevation views of the vapor deposition masks asseen from the resin mask side.

FIG. 11 presents diagrams for explaining the first stretching step andportions (a) to (c) are elevation views of the vapor deposition masks asseen from the resin mask side.

FIG. 12 presents diagrams for explaining the first stretching step andportions (a) to (c) are elevation views of the vapor deposition masks asseen from the resin mask side.

FIG. 13 presents diagrams for explaining the first stretching step andportions (a) to (c) are elevation views of the vapor deposition masks asseen from the resin mask side.

FIG. 14 presents diagrams for explaining the first stretching step andportions (a) and (b) are elevation views of the vapor deposition masksas seen from the resin mask side.

FIG. 15 is an elevation view exemplarily showing a frame-equipped vapordeposition mask.

FIG. 16 is an elevation view exemplarily showing a frame-equippedmultiple attached vapor deposition mask.

FIGS. 17(a) to 17(c) are elevation views exemplarily showing frames.

FIG. 18 is an elevation view exemplarily showing a fixing method for theframe-equipped multiple attached vapor deposition mask.

FIGS. 19(a) to 19(g) are schematic cross-sectional views showing stateswhere the stretching assistance member is fixed to the vapor depositionmask.

FIG. 20 presents diagrams for explaining the first stretching step andportions (a) and (b) are elevation views of the vapor deposition masksas seen from the resin mask side.

DESCRIPTION OF EMBODIMENTS

A method for producing a frame-equipped vapor deposition mask of anembodiment of the present invention is specifically described using thedrawings.

<<Method for Producing Frame-Equipped Vapor Deposition Mask>>

A method for producing a frame-equipped vapor deposition mask of anembodiment includes: a preparing step of preparing a vapor depositionmask including a metal mask in which a slit is formed and a resin maskin which an opening corresponding to a pattern to be produced by vapordeposition is formed at a position overlapping with the slit, the metalmask and the resin mask being stacked; a stretching assistance memberfixing step of overlapping a stretching assistance member on one surfaceof the vapor deposition mask and fixing the stretching assistance memberto the vapor deposition mask in at least part of a portion in which theone surface of the vapor deposition mask and the stretching assistancemember overlap with each other; a first stretching step of stretchingthe vapor deposition mask fixed to the stretching assistance member bypulling the stretching assistance member fixed to the vapor depositionmask; and a frame fixing step of fixing the vapor deposition mask in astate of being stretched in the first stretching step to a frame inwhich a through hole is formed. Hereafter, each of the steps isdescribed.

<Preparing Step>

As shown in FIGS. 1(a) and 1(b), the present step is a step of preparinga vapor deposition mask 100 including a metal mask 10 in which aplurality of slits 15 are formed and a resin mask 20 in which openings25 corresponding to a pattern to be produced by vapor deposition areformed at a position overlapping with the slits, the metal mask and theresin mask being stacked.

(Resin Mask)

As shown in FIG. 1, a plurality of openings 25 are provided in the resinmask 20. FIG. 1(a) is an elevation view of a vapor deposition mask of anembodiment as seen from the metal mask side and FIG. 1(b) is a schematiccross-sectional view taken along the line A-A in FIG. 1(a).

While in the mode shown in the figure, the opening shape of the opening25 exhibits a rectangular shape, the opening shape is not speciallylimited but the opening shape of the opening 25 may be rhombic orpolygonal or may be a shape having a curvature such as a circle and anellipsoid. Notably, it can be said that the rectangular or polygonalopening shape is a preferable opening shape of the opening 25 in view ofcapability of securing a larger area of light emission as compared withthe opening shape having a curvature such as a circle and an ellipsoid.

The material of the resin mask 20 is not limited but, for example, amaterial that enables formation of the opening 25 with high definitionby laser processing or the like, has a low rate of dimensional changeand a low rate of humidity absorption under heat and with passage oftime, and is light weight, is preferably used. As such materials, apolyimide resin, a polyamide resin, a polyamide-imide resin, a polyesterresin, a polyethylene resin, a polyvinylalcohol resin, a polypropyleneresin, a polycarbonate resin, a polystyrene resin, a polyacrylonitrileresin, an ethylene-vinyl acetate copolymer resin, anethylene-vinylalcohol copolymer resin, an ethylene-methacrylic acidcopolymer resin, a polyvinyl chloride resin, a polyvinylidene chlorideresin, cellophane, an ionomer resin and the like can be cited. Among thematerials shown above by way of example, the resin materials with thethermal expansion coefficients of about 16 ppm/° C. or less arepreferable, the resin materials with the rates of humidity absorption ofabout 1.0% or less are preferable, and the resin materials includingboth conditions are particularly preferable. The resin mask using theseresin materials enables dimensional precision of the openings 25 to beimproved and a rate of dimensional change and a rate of humidityabsorption under heat and with passage of time to be small.

The thickness of the resin mask 20 is not specially limited but, in thecase of further improving the effect of suppressing generation of ashadow, the thickness of the resin mask 20 is preferably about 25 μm orless, still preferably less than about 10 μm. A preferable range of thelower limit value is not specially limited but, in the case where thethickness of the resin mask 20 is less than about 3 μm, defects such asa pinhole tend to arise and a risk of deformation or the like increases.In particular, by setting the thickness of the resin mask 20 to be about3 μm or more and less than about 10 μm, still preferably about 4 μm ormore and about 8 μm or less, the influence of a shadow in formation of ahigh definition pattern exceeding 400 ppi can be more effectivelyprevented. Moreover, while the resin mask 20 may be directly bonded tothe metal mask 10 mentioned later or may be bonded thereto via anadhesive layer, in the case where the resin mask 20 is bonded to themetal mask 10 via the adhesive layer, the total thickness of the resinmask 20 and the adhesive layer is preferably within the aforementionedpreferable thickness range. Notably, the shadow is a phenomenon that apart of a vapor deposition material released from a vapor depositionsource collides with inner wall surfaces of the slit of the metal maskand/or the opening of the resin mask and does not reach the vapordeposition target, and thereby, a portion without vapor deposition thathas a film thickness smaller than the intended vapor deposition filmthickness arises.

The sectional shape of the opening 25 is not specially limited and endsurfaces that face each other and are of the resin mask forming theopening 25 may be substantially parallel to each other, but as shown inFIG. 1(b), the sectional shape of the opening 25 is preferably the shapehaving broadening toward a vapor deposition source. In other words, itpreferably has a taper surface having broadening toward the metal mask10 side. While a taper angle can be properly set with the thickness orthe like of the resin mask taken into consideration, an angle formed bya straight line connecting a lower bottom distal end in the opening ofthe resin mask and an upper bottom distal end of the opening of the sameresin mask and the bottom surface of the resin mask, in other words, anangle formed by an inner wall surface of the opening 25 and a surface ofthe resin mask 20 on the side that is not in contact with the metal mask10 (a lower surface of the resin mask in the mode shown in the figure)in the cross section in the thickness direction of the inner wallsurface constituting the opening 25 of the resin mask 20 is preferablywithin a range of about 5° to about 85°, still preferably within a rangeof about 15° to about 75°, further preferably within a range of about25° to about 65°. In particular, within this range, it is preferably anangle smaller than a vapor deposition angle of a vapor depositionmachine to be used. Moreover, in the mode shown in the figure, while anend surface that forms the opening 25 exhibits a linear shape, it is notlimited thereto but may be in a curved shape convex outward, in otherwords, a shape of the entirety of the opening 25 may be a bowl shape.

(Metal Mask)

As shown in FIG. 1(b), the metal mask 10 is stacked on one surface ofthe resin mask 20. The metal mask 10 is constituted of metal, in whichthe slits 15 extending in the lengthwise direction or the crosswisedirection are arranged. The slit 15 is synonymous with an opening. Anarrangement example of the slits is not specially limited. The slitsextending in the lengthwise direction and the crosswise direction may bearranged in a plurality of rows in the lengthwise direction and thecrosswise direction. The slits extending in the lengthwise direction maybe arranged in a plurality of rows in the crosswise direction. The slitsextending in the crosswise direction may be arranged in a plurality ofrows in the lengthwise direction. Moreover, they may be arranged in onlyone row in the lengthwise direction or the crosswise direction. Notably,“lengthwise direction” and “crosswise direction” stated in the presentspecification indicate the vertical direction and the horizontaldirection in the drawings, respectively, and may be any directions ofthe longitudinal direction and the width direction of the vapordeposition mask, the resin mask and the metal mask. For example, thelongitudinal direction of the vapor deposition mask, the resin mask andthe metal mask may be set to be the “lengthwise direction”, or the widthdirection thereof may be set to be the “lengthwise direction”. Moreover,while in the present specification, the case where the shape of thevapor deposition mask in plan view is a rectangular shape is exemplarilydescribed, it may be another shape such, for example, as a circularshape and a polygonal shape such as a rhombic shape. In this case, thelongitudinal direction of the diagonal line, the radial direction, orany direction only has to be set as the “longitudinal direction”, thedirection perpendicular to the “longitudinal direction” set as the“width direction (sometimes referred to as short-side direction)”.

The material of the metal mask 10 is not specially limited but aconventionally known one in the field of the vapor deposition mask canbe properly selected and used, and, for example, a metal material suchas stainless steel, an iron-nickel alloy and an aluminum alloy can becited. Above all, an invar material which is an iron-nickel alloy can bepreferably used since an invar material is hardly deformed by heat.

While the thickness of the metal mask 10 is not specially limited, inorder to more effectively prevent generation of a shadow, it ispreferably about 100 μm or less, still preferably about 50 μm or less,particularly preferably about 35 μm or less. Notably, in the case ofbeing thinner than about 5 μm, risks of rupture and deformation tend toincrease and handling tends to become difficult.

Moreover, while in the mode shown in FIG. 1(a), the shape of the openingof the slit 15 in plan view exhibits a rectangular shape, the openingshape is not specially limited but the opening shape of the slit 15 maybe any shape such as a trapezoid and a circle.

The sectional shape of the slit 15 formed in the metal mask 10 is notspecially limited but is preferably a shape having broadening toward thevapor deposition source as shown in FIG. 1(b). More specifically, anangle formed by a straight line connecting the lower bottom distal endin the slit 15 of the metal mask 10 and the upper bottom distal end inthe same slit 15 of the same metal mask 10 and the bottom surface of themetal mask 10, in other words, an angle formed by the inner wall surfaceof the slit 15 and the surface of the metal mask 10 on the side of beingin contact with the resin mask 20 (the lower surface of the metal maskin the shown mode) in the cross section in the thickness direction ofthe inner wall surface constituting the slit 15 of the metal mask 10 ispreferably within a range of about 5° to about 85°, still preferablywithin a range of about 15° to about 80°, further preferably within arange of about 25° to about 65°. In particular, within this range, it ispreferably an angle smaller than a vapor deposition angle of a vapordeposition machine to be used.

A method of stacking the metal mask 10 on the resin mask is notspecially limited but the metal mask 10 may be pasted on the resin mask20 using various adhesive agents or the resin mask that hasself-adhesion may be used. The dimensions of the resin mask 20 and themetal mask 10 may be the same or may be different dimensions. Notably,with fixing to a frame which is arbitrarily performed afterward takeninto consideration, the dimension of the resin mask 20 is preferablymade smaller than that of the metal mask 10 to set the outercircumferential portion of the metal mask 10 to be in the state ofexposure, which facilitates welding of the metal mask 10 to the frame.

Hereafter, preferable modes of the vapor deposition mask prepared in thepresent step are described, exemplified by Embodiment (A) and Embodiment(B).

Vapor Deposition Mask of Embodiment (A)

As shown in FIG. 2, the vapor deposition mask 100 of Embodiment (A) is avapor deposition mask for simultaneously forming vapor depositionpatterns for a plurality of screens and includes the metal mask 10 inwhich the plurality of slits 15 are provided and the resin mask 20, themetal mask being stacked on one surface of the resin mask, wherein theopenings needed for constituting the plurality of screens are providedin the resin mask 20, and each slit 15 is provided at a positionoverlapping with the entirety of at least one screen.

The vapor deposition mask 100 of Embodiment (A) is a vapor depositionmask used for simultaneously forming vapor deposition patterns for aplurality of screens. One vapor deposition mask 100 can simultaneouslyform vapor deposition patterns compatible with a plurality of products.“Openings” stated for the vapor deposition mask of Embodiment (A) meanpatterns to be produced using the vapor deposition masks 100 ofEmbodiment (A). For example, when the vapor deposition mask is used forforming an organic layer in an organic EL display, the shape of theopenings 25 is a shape of the organic layer. Moreover, “one screen” isconstituted of an aggregate of openings 25 corresponding to one product.When the one product is an organic EL display, an aggregate of organiclayers needed for forming one organic EL display, in other words, anaggregate of openings 25 to be the organic layers is “one screen”.Further, in the vapor deposition mask 100 of Embodiment (A), in order tosimultaneously form the vapor deposition patterns for the plurality ofscreens, the aforementioned “one screen” is arranged for each of theplurality of screens in the resin mask 20 at predetermined intervals.Namely, in the resin mask 20, the openings 25 needed for constitutingthe plurality of screens are provided.

The vapor deposition mask of Embodiment (A) includes the metal mask 10in which the plurality of slits 15 are provided, the metal mask beingprovided on one surface of the resin mask, wherein each slit is providedat the position overlapping with the entirety of at least one screen. Inother words, it is characterized in that between the openings 25 neededfor constituting one screen, metal line portions which have the samelength as the length of the slit 15 in the lengthwise direction and havethe same thickness as that of the metal mask 10 between the openings 25adjacent in the crosswise direction, or metal line portions which havethe same length as the length of the slit 15 in the crosswise directionand have the same thickness as that of the metal mask 10 between theopenings 25 adjacent in the lengthwise direction do not exist.Hereafter, the metal line portions which have the same length as thelength of the slit 15 in the lengthwise direction and have the samethickness as that of the metal mask 10 and the metal line portions whichhave the same length as the length of the slit 15 in the crosswisedirection and have the same thickness as that of the metal mask 10 aresometimes collectively referred to simply as metal line portions.

According to the vapor deposition mask 100 of Embodiment (A), even whenthe dimension of the openings 25 needed for constituting one screen andthe pitch between the openings 25 constituting one screen are madesmall, for example, even when the dimension of the openings 25 and thepitch between the openings 25 are made extremely fine in order to form ascreen exceeding 400 ppi, interference due to metal line portions can beprevented and an image with high definition can be formed. Notably, whenone screen is divided by a plurality of slits, in other words, when themetal line portions having the same thickness as that of the metal mask10 exist between the openings 25 constituting one screen, as the pitchbetween the openings 25 constituting one screen is smaller, the metalline portions existing between the openings 25 more become a hindrancein forming the vapor deposition pattern on the vapor deposition targetand the vapor deposition pattern with high definition is more difficultto be formed. In other words, when the metal line portions having thesame thickness as that of the metal mask 10 exist between the openings25 constituting one screen, the metal line portions in the case ofsetting the frame-equipped vapor deposition mask cause generation of ashadow, which results in difficulty of formation of a screen with highdefinition.

Next, referring to FIG. 2 to FIG. 6, the openings 25 constituting onescreen are exemplarily described. Notably, a region enclosed by a brokenline in the modes shown in the figures is one screen. While in the modesshown in the figures, an aggregate of a small number of openings 25 isone screen for convenience of description, not limited to these modes,for example, the openings 25 for millions of pixels may be present inone screen, where one opening 25 is one pixel.

In the mode shown in FIG. 2, one screen is constituted of an aggregateof openings 25 having a plurality of openings 25 provided in thelengthwise direction and the crosswise direction. In the mode shown inFIG. 3, one screen is constituted of an aggregate of openings 25 havinga plurality of openings 25 provided in the crosswise direction.Moreover, in the mode shown in FIG. 4, one screen is constituted of anaggregate of openings 25 having a plurality of openings 25 in thelengthwise direction. Further, in FIG. 2 to FIG. 4, the slit 15 isprovided at a position overlapping with the entirety of one screen.

As described above, the slit 15 may be provided at a positionoverlapping with only one screen, or as shown in FIGS. 5(a) and 5(b),may be provided at a position overlapping with the entirety of two ormore screens. In FIG. 5(a), in the resin mask 10 shown in FIG. 2, theslit 15 is provided at a position overlapping with the entirety of twoscreens continuous in the crosswise direction. In FIG. 5(b), the slit 15is provided at a position overlapping with the entirety of three screenscontinuous in the lengthwise direction.

Next, exemplified by the mode shown in FIG. 2, pitches between theopenings 25 constituting one screen and pitches between the screens aredescribed. The pitches between the openings 25 constituting one screenand the dimension of the opening 25 are not specially limited but can beproperly set depending on the pattern to be produced by vapordeposition. For example, when forming the vapor deposition pattern withhigh definition of 400 ppi, a pitch (P1) in the crosswise direction anda pitch (P2) in the lengthwise direction between the neighboringopenings 25 out of the openings 25 constituting one screen are about 60μm. Moreover, the dimension of the opening is about 500 μm² to about1000 μm². Moreover, one opening 25 is not limited to correspond to onepixel but, for example, a plurality of pixels can also be collectivelyone opening 25 depending on a pixel arrangement.

While a pitch (P3) in the crosswise direction and a pitch (P4) in thelengthwise direction between the screens are not specially limited but,as shown in FIG. 2, when one slit 15 is provided at the positionoverlapping with the entirety of one screen, metal line portions are toexist between the screens. Accordingly, when the pitch (P3) in thecrosswise direction and the pitch (P4) in the lengthwise directionbetween the screens are smaller than or substantially equal to the pitch(P1) in the crosswise direction and the pitch (P2) in the lengthwisedirection of the openings 25 provided in one screen, the metal lineportions existing between the screens are liable to break. Accordingly,with this point taken into consideration, the pitch (P3, P4) between thescreens is preferably wider than the pitch (21, P2) between the openingsconstituting one screen. The pitch (P3, P4) between the screens isexemplarily about 1 mm to about 100 mm. Notably, the pitch between thescreens means the pitch between the neighboring openings in one screenand another screen adjacent to the one screen. The same holds true forthe pitch between the openings 25 and the pitch between the screens inthe vapor deposition mask of Embodiment (B) mentioned later.

Notably, as shown in FIG. 5, when one slit 15 is provided at theposition overlapping with the entirety of two or more screens, metalline portions constituting the inner wall surfaces of the slit are notto exist between the plurality of screens provided in the one slit 15.Accordingly, in this case, the pitch between the two or more screensprovided at the position overlapping with the one slit 15 may besubstantially equal to the pitch between the openings 25 constitutingone screen.

Moreover, on the resin mask 20, grooves (not shown) are preferablyformed to extend in the lengthwise direction or the crosswise directionof the resin mask 20. While in the case of application of heat in vapordeposition, there is a possibility that the resin mask 20 undergoesthermal expansion, and thereby, changes in dimension and position of theopening 25 arise, by forming the grooves, they can absorb the expansionof the resin mask, and can prevent the changes in dimension and positionof the opening 25 caused by the resin mask 20 expanding in apredetermined direction as a whole due to accumulation of thermalexpansions arising in portions in the resin mask. Formation positions ofthe grooves are not limited but while they may be provided between theopenings 25 constituting one screen and at positions overlapping withthe openings 25, they are preferably provided between the screens.Moreover, the grooves may be provided on one surface of the resin mask,for example, only on the surface on the side that is in contact with themetal mask, or may be provided only on the surface on the side that isnot in contact with the metal mask. Otherwise, they may be provided onboth surfaces of the resin mask 20.

Moreover, the grooves extending in the lengthwise direction may bebetween the neighboring screens, or the grooves extending in thecrosswise direction may be formed between the neighboring screens.Furthermore, the grooves can also be formed in an aspect having thesecombined.

The depth and the width of the grooves are not specially limited butsince the rigidity of the resin mask 20 tends to decrease in the casewhere the depth of the grooves is too large and in the case where thewidth thereof is too large, setting is needed with this point taken intoconsideration. Moreover, the sectional shape of the grooves is notspecially limited but only has to be arbitrarily selected as a U-shape,a V-shape or the like with the processing method and the like taken intoconsideration. The same holds true for the vapor deposition mask ofEmbodiment (B).

Vapor Deposition Mask of Embodiment (B)

Next, the vapor deposition mask of Embodiment (B) is described. As shownin FIG. 6, the vapor deposition mask of Embodiment (B) includes themetal mask 10 in which one slit (one hole 16) is provided and the resinmask 20 in which the plurality of openings 25 corresponding to a patternto be produced by vapor deposition are provided, the metal mask beingstacked on one surface of resin mask, wherein all of the plurality ofopenings 25 are provided at a position overlapping with the one holeprovided in the metal mask 10.

The opening 25 stated for the vapor deposition mask of Embodiment (B)means an opening needed for forming the vapor deposition pattern on thevapor deposition target. An opening not needed for forming the vapordeposition pattern on the vapor deposition target may be provided at aposition of not overlapping with the one hole 16. Notably, FIG. 6 is anelevation view which exemplarily shows the vapor deposition mask ofEmbodiment (B) and is of the vapor deposition mask as seen from themetal mask side.

In the vapor deposition mask 100 of Embodiment (B), the metal mask 10having the one hole 16 is provided on the resin mask 20 having theplurality of openings 25, and all of the plurality of openings 25 areprovided at a position overlapping with the one hole 16. In the vapordeposition mask 100 of Embodiment (B) that has this configuration, metalline portions that have the same thickness as the thickness of the metalmask or a larger thickness than the thickness of the metal mask do notexist between the openings 25. Hence, as described for theaforementioned vapor deposition mask of Embodiment (A), the vapordeposition pattern with high definition can be formed to match thedimensions of the openings 25 provided in the resin mask 20 withoutsuffering interference of metal line portions.

Moreover, according to the vapor deposition mask of Embodiment (B),there is almost no influence of a shadow even when the thickness of themetal mask 10 is made large. Hence, the thickness of the metal mask 10can be made larger to such an extent that durability and handlingability are sufficiently satisfied. While a vapor deposition patternwith high definition can be formed, durability and handling ability canbe improved.

(Resin Mask)

The resin mask 20 in the vapor deposition mask of Embodiment (B) isconstituted of resin, in which as shown in FIG. 6, the plurality ofopenings 25 corresponding to a pattern to be produced by vapordeposition are provided at a position overlapping with the one hole 16.The openings 25 correspond to the pattern to be produced by vapordeposition. By a vapor deposition material released from a vapordeposition source passing through the openings 25, the vapor depositionpattern corresponding to the openings 25 is formed on the vapordeposition target. Notably, while in the mode shown in the figure, theopenings arranged in a plurality of rows in the lengthwise direction andthe crosswise direction are exemplarily described, they may be arrangedonly in the lengthwise direction or in the crosswise direction.

“One screen” in the vapor deposition mask 100 of Embodiment (B) means anaggregate of openings 25 corresponding to one product. When the oneproduct is an organic EL display, an aggregate of organic layers neededfor forming one organic EL display, in other words, an aggregate ofopenings 25 to be the organic layers is “one screen”. While the vapordeposition mask of Embodiment (B) may be constituted of only “onescreen” or may be provided by arranging the “one screen” for each of aplurality of screens, in the case where the “one screen” is arranged foreach of the plurality of screens, the openings 25 are preferablyprovided at predetermined intervals on a screen-by-screen basis (referto FIG. 5 for the vapor deposition mask of Embodiment (A)). The mode of“one screen” is not specially limited but, for example, the one screencan also be constituted of millions of openings 25, where one opening 25is one pixel.

(Metal Mask)

The metal mask 10 in the vapor deposition mask 100 of Embodiment (B) isconstituted of metal and includes the one hole 16. Further, in anembodiment of the present invention, the one hole 16 is disposed at aposition overlapping with all of the openings 25 as seen head-on of themetal mask 10, in other words, at a position where all of the openings25 arranged in the resin mask 20 can be seen.

The metal portion constituting the metal mask 10, that is, the portionthereof other than the one hole 16 may be provided along the outer edgeof the vapor deposition mask 100 as shown in FIG. 6, or the dimension ofthe metal mask 10 may be made smaller than that of the resin mask 20 toexpose an outer circumferential portion of the resin mask 20 as shown inFIG. 7. Moreover, the dimension of the metal mask 10 may be made largerthan that of the resin mask 20, so that a part of the metal portion iscaused to protrude outward in the crosswise direction of the resin maskor outward in the lengthwise direction thereof. Notably, in any cases,the dimension of the one hole 16 is configured to be smaller than thedimension of the resin mask 20.

While a width (W1), in the crosswise direction, and a width (W2), in thelengthwise direction, of the metal portion constituting the wall surfaceof the one hole 16 of the metal mask 10 shown in FIG. 6 are notspecially limited, as the width W1, W2 is made smaller, durability andhandling ability tend to deteriorate more. Accordingly, W1 and W2 arepreferably widths by which durability and handling ability aresufficiently satisfied. While appropriate widths can be properly setdepending on the thickness of the metal mask 10, as an example ofpreferable widths, both W1 and W2 are about 1 mm to about 100 mm, whichare the same widths of the metal mask in the vapor deposition mask ofEmbodiment (A).

Hereafter, the method for producing a vapor deposition mask of anembodiment prepared in the present step is exemplarily described. Thevapor deposition mask 100 of an embodiment can be obtained by preparingthe resin plate-equipped metal mask in which the metal mask 10 providedwith the slits 15 is stacked on one surface of the resin plate, andnext, irradiating the resin plate-equipped metal mask with laser throughthe slits 15 from the metal mask 10 side to form the openings 25corresponding to a pattern to be produced by vapor deposition in theresin plate.

As a method of forming the resin plate-equipped metal mask, the metalmask 10 provided with the slits 15 is stacked on one surface of theresin plate. The resin plate can employ the materials described for theaforementioned resin mask 20.

As the method for forming the metal mask 10 in which the slits 15 areprovided, a masking member, for example, a resist material is appliedonto the surface of the metal plate, predetermined portions thereof areexposed and developed, and thereby, a resist pattern in which positionswhere the slits are finally to be formed remain is formed. The resistmaterial used as the masking member is preferably excellent inprocessing ability with desired resolution. Next, etching processing isperformed by an etching method using the resist pattern as an etchingresistant mask. After the completion of the etching, the resist patternis cleaned and removed. In this way, the metal mask 10 in which theslits 15 are provided is obtained. The etching for forming the slits 15may be performed on one surface side of the metal plate or may beperformed on both surfaces thereof. Moreover, in the case where theslits 15 are formed in the metal plate using the stacked body in whichthe resin plate is provided on the metal plate, the masking member isapplied onto the surface of the metal plate on the side that is not incontact with the resin plate, and the slits 15 are formed by the etchingfrom one surface side. Notably, in the case where the resin plate hasetching resistance with respect to the etching agent for the metalplate, masking of the surface of the resin plate is not needed but, inthe case where the resin plate does not have resistance with respect tothe etching agent for the metal plate, the masking member is needed tobe applied onto the surface of the resin plate. Moreover, in the above,while the resist material is mainly described as the masking member, inplace of the application of the resist material, a dry film resist maybe laminated to perform the similar patterning.

In the aforementioned method, the resin plate constituting the resinplate-equipped metal mask may be a resin layer or a resin film formed bycoating as well as a plate-shaped resin. In other words, the resin platemay be beforehand prepared, or the resin layer or the resin film to bethe resin mask in the final stage can also be formed on the metal plateby a conventionally known coating method or the like.

The openings 25 can be formed using a laser processing method, finepress processing, photolithography processing or the like on the resinplate-equipped metal mask prepared above. By forming the openings, thevapor deposition mask 100 of an embodiment is obtained in which themetal mask 10 provided with the slits 15 is stacked on one surface ofthe resin mask 20 in which the openings 25 corresponding to the patternto be produced by vapor deposition are provided. Notably, in view ofcapability of easily forming the openings 25 with high definition, thelaser processing method is preferably used for the formation of theopenings 25.

<Stretching Assistance Member Fixing Step>

As shown in FIGS. 8(a) to 8(c), the stretching assistance member fixingstep is a step of overlapping stretching assistance members 50 on onesurface of the vapor deposition mask 100 (in the mode shown in thefigures, the surface of the resin mask 20), and fixing the stretchingassistance members to the vapor deposition mask 100 in at least part ofa portion in which the one surface of the vapor deposition mask 100 andthe stretching assistance members 50 overlap with each other (signs X inthe figures). FIG. 8 presents elevation views showing the states wherethe one surface of the vapor deposition mask and the stretchingassistance members 50 are fixed to each other, and in the modes shown inthe figures, the resin mask 20 and the stretching assistance members 50are fixed to each other in the entirety of a portion in which thesurface of the resin mask 20 of the vapor deposition mask 100 and thestretching assistance members 50 overlap with each other or in a part ofthe portion of overlapping. In other words, in plan view of the vapordeposition mask 100, that is, in the thicknesswise direction of thevapor deposition mask 100, the stretching assistance members 50 arearranged so as to overlap with one surface of the vapor deposition mask,and the one surface of the vapor deposition mask 100 and the stretchingassistance members 50 are fixed to each other in the entirety of theportion of overlapping or in a part of the portion of overlapping.Notably, in FIG. 8, illustration of the openings provided in the resinmask 20 is omitted and one screen constituted of the plurality ofopenings is illustrated. The “one screen” is the same as those describedfor the aforementioned vapor deposition mask of Embodiment (A) and vapordeposition mask of Embodiment (B).

In the present step, the stretching assistance member 50 is overlappedon one surface of the vapor deposition mask 100, and the vapordeposition mask 100 and the stretching assistance member 50 are fixed toeach other in at least part of a portion in which the one surface of thevapor deposition mask and the stretching assistance member 50 overlapwith each other. In other words, the stretching assistance member 50 canbe fixed at any position as long as it is a position which satisfies thecondition of being able to be overlapped with the surface of the vapordeposition mask. Accordingly, differently from a conventionally knowngripping device such, for example, as a clamp which fixes a vapordeposition mask to pinch its end part, the position where the stretchingassistance member is fixed is not limited but it can be fixed to thevapor deposition mask 100 at any position. Notably, clamps and the likewhich perform fixation by gripping the end part or the like of a vapordeposition mask are excluded from the stretching assistance members 50stated in the specification of the present application.

Moreover, in the mode shown in each figure, while the stretchingassistance members 50 are fixed to the vapor deposition mask 100 in atleast part of a portion in which one surface of the vapor depositionmask 100 and the stretching assistance members 50 overlap with eachother (signs X in the figure), the vapor deposition mask 100 and thestretching assistance members 50 may be fixed to each other in theentirety of the portion in which the one surface of the vapor depositionmask 100 and the stretching assistance members 50 overlap with eachother.

The stretching assistance member may be fixed onto the resin mask 20 asshown in the figures, or may also be fixed onto the metal mask 10.Notably, in a frame-equipped vapor deposition mask obtained in the finalstage, the metal mask 10 of the vapor deposition mask 100 is typicallyfixed to a frame to oppose the same. Accordingly, with this point takeninto consideration, the stretching assistance member 50 is preferablyfixed in at least part that overlaps with the surface on the resin mask20 side. Notably, as long as the stretching assistance member 50 can beremoved from the surface of the vapor deposition mask after the vapordeposition mask is fixed to the frame, fixation in at least part thatoverlaps with the surface on the metal mask 10 side does not cause anyproblem.

The stretching assistance member 50 is sufficient to be fixed onto onesurface of the vapor deposition mask 100 in at least part of a portionoverlapping with the one surface of the vapor deposition mask 100 bysome device, and its material is not limited at all. For example, thestretching assistance member 50 may be constituted of a resin materialor a metal material, or may also be constituted of other materials such,for example, as a glass material, a ceramic material and a papermaterial.

The stretching assistance member 50 is not limited in its shape but issufficient to exhibit a shape with which one surface of the vapordeposition mask 100 and the surface of the stretching assistance membercan be fixed to each other by some device. In other words, thestretching assistance member 50 may have any shape. The stretchingassistance member 50 by way of example exhibits a sheet shape, acylindrical shape, a prismatic shape or the like. Notably, in the modesshown in the figures, while stretching of the vapor deposition mask 100is performed using sheet-shaped stretching assistance members as thestretching assistance members 50, they are not limited to these modes.Moreover, the size and the thickness of the stretching assistance member50 are not limited at all. For example, in the case of using asheet-shaped stretching assistance member 50, the thickness and the likethereof are not limited at all. The surface of the stretching assistancemember 50 and the vapor deposition mask come into direct or indirectcontact with each other, and the mode of the contact is not speciallylimited but the surface of the stretching assistance member 50 and thevapor deposition mask may come into direct or indirect contact with eachother in plane, on a line or at a point. For example, in the case ofusing a sheet-shaped stretching assistance member, the relevantstretching assistance member 50 and one surface of the vapor depositionmask 100 come into direct or indirect contact with each other in plane.Moreover, in the case of using a cylindrical stretching assistancemember, the circumferential surface of the relevant stretchingassistance member 50 and one surface of the vapor deposition mask comeinto direct or indirect contact with each other on a line.

The stretching assistance members 50 by way of example are joined to adriving device, and stretching of the vapor deposition mask 100 fixed tothe relevant stretching assistance members is performed by operating thedriving device to pull the stretching assistance members 50. For thedriving device, a conventionally known one can be properly selected and,for example, a motor, an air cylinder, an electric actuator or the likecan be cited. Moreover, not using a driving device, the vapor depositionmask 100 fixed to the stretching assistance members 50 can also bestretched. For example, the vapor deposition mask fixed to thestretching assistance members 50 can also be stretched by pulling thestretching assistance members 50 by hands. In this case, the stretchingassistance members 50 are sufficient not to be joined to a drivingdevice.

One surface of the vapor deposition mask 100 and the stretchingassistance member 50 may be fixed to each other (i) in the state ofdirect contact of those or may also be fixed to each other (ii) in thestate of indirect contact of those.

As modes of fixation of one surface of the vapor deposition mask 100 andthe stretching assistance member 50 (i) in the state of direct contactof those, a mode using a material having magnetism for the stretchingassistance member 50, a mode using a material having self-adhesiontherefor, a mode using a material having self-adsorption andrepeelability therefor, and a mode of fixing one surface of the vapordeposition mask 100 and the stretching assistance member 50 to eachother with electrostatic adsorption or the like can be cited. Forexample, in the case of using a material having magnetism for thestretching assistance member 50, using the metal mask constituting thevapor deposition mask 100, the vapor deposition mask 100 and thestretching assistance member 50 can be caused to attract and be fixed toeach other with magnetic force at a position where the stretchingassistance member 50 and the metal mask 10 overlap with each other.Moreover, in the case of using a material having self-adsorption andrepeelability for the stretching assistance member 50, using theself-adsorption, the stretching assistance member 50 can be fixed at aposition where the stretching assistance member 50 and the surface ofthe vapor deposition mask overlap with each other. With the materialhaving self-adsorption and repeelability, the stretching assistancemember 50 can be fixed to the surface of the vapor deposition mask 100even at a position not overlapping with the metal mask 10 in thethicknesswise direction.

Above all, it can be said that the material having magnetism and thematerial having self-adsorption and repeelability are preferablematerials in that they can be used repeatedly. The self-adsorption ofthe stretching assistance member means a property with which it can bebrought into close contact with the vapor deposition mask while pushingaway the air in coming into contact therewith. The repeelability of thestretching assistance member means a property with which pulling up oneend of the stretching assistance member fixed to the vapor depositionmask causes the peeling to spread around and enables the entirety of thestretching assistance member to be removed. As materials having theaforementioned self-adsorption and repeelability, self-adhesion resinssuch as silicon resin-based ones, polyolefin resin-based ones, andpolyurethane-based thermoplastic elastomer-based ones, rubber-basedones, and polyvinyl chloride resin-based ones can be cited. As materialshaving self-adsorption and repeelability, for example, commercialproducts such as Sumilon S (product name) by Sumitomo Chemical Co. Ltd.,Olefin Gel Polymer Sheet (product name) by Panac Corporation, andFIXFILM (product name) by Fujicopian Co. Ltd. can also be used. Thematerial having magnetism and the material having self-adsorption andrepeelability can also be combined and used. For the stretchingassistance member 50, one constituted of a single member may be used, orone constituted of a plurality of members which are combined may also beused. Moreover, a method of combination in the case where a plurality ofmembers are combined to constitute the stretching assistance member isnot limited but there may be the stretching assistance memberconstituted by arranging the plurality of members regardless of theirorientation or the stretching assistance member 50 constituted bystacking the plurality of members. For example, in the case of thestretching assistance members 50 obtained by combining the materialhaving magnetism on the material having self-adsorption, the vapordeposition mask 100 can be stretched while a property of the materialhaving magnetism is utilized to tentatively fix the metal mask andassistance frames 65 mentioned later to each other. Moreover, in thecase of using a plurality of stretching assistance members 50, membersand materials constituting the individual stretching assistance membersmay be the same or different from one another.

As a mode of fixation of one surface of the vapor deposition mask 100and the stretching assistance member 50 to each other (ii) in the stateof indirect contact of those, a mode of indirectly fixing the vapordeposition mask 100 and the stretching assistance member 50 to eachother using a predetermined member can be cited. As the predeterminedmember, for example, an adhesive agent, an adhesive sheet, a materialhaving magnetism and a material having self-adsorption and repeelabilitywhich are exemplarily presented as the aforementioned materials of thestretching assistance member 50 can be cited. The predetermined membermay be a member for indirectly joining the vapor deposition mask and thestretching assistance member 50 to each other, in other words, one thatdoes not constitute the stretching assistance member 50, and can be usedas a stretching assistance member body part 50A mentioned later (referto stretching assistance member body parts 50A in FIGS. 19(a) to 19(d)and 19(f)). In the latter case, the predetermined member constitutes thestretching assistance member body part 50A and the stretching assistancemember 50 described here constitutes a stretching assistance memberextension part 50B. The predetermined member is preferably constitutedof a material having a small coefficient of extension in the occasionwhen the stretching assistance member 50 is pulled. More specifically,it is preferable that the material of the predetermined member whichindirectly joins the vapor deposition mask and the stretching assistancemember 50 to each other have a smaller coefficient of extension than thematerial constituting the resin mask 10 of the vapor deposition mask100. To indirectly fix the vapor deposition mask and the stretchingassistance member 50 to each other with such a member can suppress thepredetermined member from extending when the stretching assistancemembers are pulled, which enables the vapor deposition mask to bestretched more precisely. Notably, in the case where the material of thepredetermined member has the same coefficient of extension as that ofthe material constituting the resin mask 10, or is a material having alarger coefficient of extension than the same, as compared with the casewhere a material having a small coefficient of extension is used as thematerial of the predetermined member, precision in the occasion when thevapor deposition mask is stretched tends to be lower. Nevertheless,since the predetermined member undergoes expansion and contraction orthe like when the stretching assistance members 50 are pulled, thedegree of freedom in extension and contraction of the predeterminedmember can be made larger. When the degree of freedom in extension andcontraction of the predetermined member which indirectly joins the vapordeposition mask and the stretching assistance member 50 to each other ismade large, external force arising in the case where the vapordeposition mask is fixed to the frame in the state where the vapordeposition mask is being stretched with the stretching assistancemembers 50 or the similar case can be absorbed by the predeterminedmember. In other words, the predetermined member can suppressdeformation or the like on the vapor deposition mask, positionaldisplacement on the vapor deposition mask, or the similar situation fromarising due to the external force. Notably, the coefficient of extensionstated here means the coefficient of tensile extension based on JIS K7127(1999).

Moreover, in the mode (ii), a distance from the surface of the vapordeposition mask 100 to the surface of the stretching assistance member50 can be secured by an amount of the thickness of the predeterminedmember, and the stretching assistance member 50 can be suppressed fromcoming into direct contact with the surface of the vapor deposition mask100 at a place other than the fixing place where the vapor depositionmask 100 and the stretching assistance member 50 are in indirect contactwith each other. For example, in the case where the stretchingassistance member 50 and the vapor deposition mask 100 are fixed to eachother in the vicinity of the center of one surface of the vapordeposition mask in the aforementioned fixing mode (i), when thestretching assistance member 50 is pulled, the surface of the vapordeposition mask and the, stretching assistance member 50 are to comeinto contact with each other also in a region other than the regionwhere the stretching assistance member 50 and the vapor deposition maskare fixed to each other, that is, a region other than the vicinity ofthe center, and there can be a case where the surface of the vapordeposition mask is damaged and the similar case depending on thematerial and the like of the stretching assistance member 50.Specifically, in the case where the surface of the vapor deposition maskfixed to the stretching assistance member 50 is the surface on the resinmask 20 side and the stretching assistance member 50 that is constitutedof a metal material or the like which is harder than the material of theresin mask is in contact with the surface of the resin mask in a regionother than the fixing place, when the stretching assistance member 50 ispulled, there can be a case where the stretching assistance member 50damages the surface of the resin mask in other than the fixing place.

Likewise, in the case where a plurality of vapor deposition masks arearranged to line up in the width direction, when one vapor depositionmask fixed to the stretching assistance member is stretched in the widthdirection of the vapor deposition mask by pulling the relevantstretching assistance member 50 directly fixed to one surface of the onevapor deposition mask of the plurality of vapor deposition masks, thestretching assistance member 50 is also to come into contact with onesurface of another vapor deposition mask adjacent to the one vapordeposition mask in the width direction. Depending on the material andthe like of the stretching assistance member 50, when the stretchingassistance member 50 fixed to the one vapor deposition mask comes intocontact with the surface of the other vapor deposition mask, there canbe a case where it damages the surface of the other vapor depositionmask or the similar case. Accordingly, when fixation is performed in theaforementioned fixing mode (i), the stretching assistance member 50 thatis constituted of a material that does not damage the surface of thevapor deposition mask, such, for example, as resin is preferably used.When the stretching assistance member 50 that is constituted of amaterial such as resin is used, contact of the stretching assistancemember 50 fixed to the one vapor deposition mask with the surface of theother vapor deposition mask does not cause a remarkable problem.

Moreover, when the stretching assistance member 50 that is constitutedof a material such as resin is used as the stretching assistance member50, slippage is given to the stretching assistance member 50. Even whenthe stretching assistance member 50 fixed to the one vapor depositionmask comes into contact with the surface of the other vapor depositionmask, the stretching assistance member 50 fixed onto the one surface ofthe one vapor deposition mask can be easily pulled without damaging thesurface of the other vapor deposition mask. In an exemplary preferablemode, the stretching assistance member 50 is fixed to the vapordeposition mask 100 in the aforementioned fixing mode (ii) and astretching assistance member 50 that is constituted of a material havinga small coefficient of extension, for example, a metal material is usedas the stretching assistance member 50. According to this mode, whilesuppressing the stretching assistance member 50 from coming into contactwith the surface of the vapor deposition mask 100, the stretchingassistance member 50 itself can be suppressed from extending whenstretching the stretching assistance member 50, which enables the vapordeposition mask fixed to the stretching assistance member to bestretched with more excellent precision. Moreover, even in the case ofsetting the fixing mode (i), as mentioned later, by bending thestretching assistance member 50 (refer to FIGS. 19(e) and 19(g)), thestretching assistance member 50 can also be suppressed from coming intocontact with the surface of the vapor deposition mask 100.

In the above, exemplified by the fixing mode (i) and the fixing mode(ii), preferred embodiments of the stretching assistance member 50 havebeen described. By configuring the stretching assistance member 50 ofthe stretching assistance member body part 50A and the stretchingassistance member extension part 50B, various problems which can arisein pulling the stretching assistance member 50 can also be suppressed.

The stretching assistance member body part 50A is a stretchingassistance member that comes into contact with the surface of the vapordeposition mask 100 and is fixed to the vapor deposition mask 100 in atleast part of the stretching assistance member body part 50A and thesurface of the vapor deposition mask 100 overlapping with each other,and the stretching assistance member extension part 50B is a stretchingassistance member that is joined to the stretching assistance memberbody part 50A and is not fixed to the surface of the vapor depositionmask 100.

In a stretching assistance member 50 by way of example, the stretchingassistance member extension part 50B is constituted of a material hardlydamaging the surface of the vapor deposition mask, for example, amaterial such as resin. FIGS. 19(a) and 19(f) are schematiccross-sectional views exemplarily showing states where the stretchingassistance member 50 constituted of the stretching assistance memberbody part 50A and the stretching assistance member extension part 50Band one vapor deposition mask 100 are fixed to each other in at leastpart of the stretching assistance member body part 50A and the surfaceof the vapor deposition mask 100 overlapping with each other. In themodes shown in FIGS. 19(a) and 19(f), to the one vapor deposition mask100 in the width direction, another vapor deposition mask 100A adjacentto the relevant one vapor deposition mask 100 is positioned, and thestretching assistance member extension part 50B is in contact with thesurface of the other vapor deposition mask 100A. In the modes shown inthe figures, the stretching assistance member extension part 50B isconnected to a driving device 55, and by operating the driving device55, stretching of the one vapor deposition mask 100 fixed to thestretching assistance member 50 is performed. In the cases of settingthe modes shown in FIGS. 19(a) and 19(f), the stretching assistancemember extension part 50B is preferable a stretching assistance memberextension part 50B constituted of a material hardly damaging the surfaceof the vapor deposition mask. Using such a stretching assistance memberextension part 50B, even in the case where the stretching assistancemember extension part 50B and the surface of the other vapor depositionmask 100A come into contact with each other when pulling the stretchingassistance member 50, the surface of the other vapor deposition mask100A can be suppressed from being damaged.

FIGS. 19(b) to 19(d) are schematic cross-sectional views exemplarilyshowing other examples of the state where the stretching assistancemember 50 constituted of the stretching assistance member body part 50Aand the stretching assistance member extension part 50B and one vapordeposition mask 100 are fixed to each other in at least part of aportion where the stretching assistance member body part 50A and thesurface of the vapor deposition mask 100 overlap with each other.Similarly to FIGS. 19(a) and 19(f), to the one vapor deposition mask 100in the width direction, another vapor deposition mask 100A adjacent tothe relevant one vapor deposition mask 100 is positioned. In the modeshown in FIG. 19(b), the surface of the other vapor deposition mask 100Aadjacent to the one vapor deposition mask 100 and the stretchingassistance member extension part 50B are not in contact with each other.Moreover, in the modes shown in FIGS. 19(c) and 19(d), the stretchingassistance member 50 constituted of the stretching assistance memberbody part 50A and the stretching assistance member extension part 50Bexhibits a step-like shape as its sectional shape as a whole, and thesurface of the other vapor deposition mask 100A adjacent to the onevapor deposition mask 100 and the stretching assistance member extensionpart 50B are not in contact with each other. Therefore, according to themodes shown in FIGS. 19(b) to 19(d), the surface of the other vapordeposition mask 100A can be suppressed from being damaged irrespectiveof the material of the stretching assistance member extension part 50B.In the case of setting the mode in which the surface of the other vapordeposition mask 100A and the stretching assistance member extension part50B are not in contact with each other, it is preferable that a materialhaving a small coefficient of extension, for example, a metal materialor the like be used as the stretching assistance member extension part50B. The stretching assistance member extension part 50B that isconstituted of a metal material or the like can suppress the stretchingassistance member 50 itself from extending in pulling the stretchingassistance member 50, which enables the vapor deposition mask to bestretched with more excellent precision.

In the mode shown in FIG. 19(f), the sectional shape of the stretchingassistance member extension part 50B is set to be a step-like shape, andthe area in which the stretching assistance member extension part 50Band the surface of the adjacent other vapor deposition mask 100A are incontact with each other is made small. According to this mode, thesurface of the other vapor deposition mask 100A can be suppressed frombeing damaged irrespective of the material of the stretching assistancemember extension part 50B. Moreover, variation in position of the othervapor deposition mask 100A due to the stretching assistance member 50and the other vapor deposition mask 100A coming into contact with eachother can also be suppressed.

As the material of the stretching assistance member extension part 50Bin the case of setting the modes of FIGS. 19(c), 19(d) and 19(f), amaterial that can be bent and maintain the shape obtained by thebending, for example, a thin plate of metal or the like can be used. Asspecific examples, a leaf spring, a bracket and the like can be cited.

While in FIGS. 19(a) to 19(d) and 19(f), the thicknesses of thestretching assistance member body part 50A and the stretching assistancemember extension part 505 are substantially the same thickness, they maybe different thicknesses. Moreover, the width of the stretchingassistance member body part 50A may be larger or smaller than or thesame as the width of the stretching assistance member extension part 50B(the same width in the modes shown in the figures). Moreover, the shapesof the stretching assistance member body part 50A and the stretchingassistance member extension part 50B may be different shapes. Forexample, in the mode shown in FIG. 19(a), the stretching assistancemember body part 50A can be set to be sheet-like and the stretchingassistance member extension part 50B to be cylindrical, and thereby,while enhancing fixing strength by enlarging the area in which one vapordeposition mask and the stretching assistance member body part 50A arein contact with each other, the area in which another vapor depositionmask 100A adjacent to the one vapor deposition mask 100 and thestretching assistance member extension part 50B are in contact with eachother can be reduced, which enables the influence of the stretchingassistance member 50 to the other vapor deposition mask 100A adjacent tothe one vapor deposition mask 100 to be reduced. The stretchingassistance member body part 50A and the vapor deposition mask 100 may bedirectly fixed or may also be indirectly fixed to each other.

Moreover, as shown in FIGS. 19(e) and 19(g), the stretching assistancemember 50 can also be bent such that the sectional shape is a step-likeshape, so that the surface of the other vapor deposition mask 100Aadjacent to the one vapor deposition mask 100 and the stretchingassistance member 50 are not in contact with each other or the area oftheir contact is made small. Each of the stretching assistance members50 shown in FIGS. 19(e) and 19(g) is in a mode in which one stretchingassistance member is bent.

In FIG. 19, relation between one vapor deposition mask 100 in the casewhere a plurality of vapor deposition masks are arranged in the widthdirection of the relevant vapor deposition masks, another vapordeposition mask 100A adjacent to the one vapor deposition mask 100, andthe stretching assistance member 50 has been described. Also in the caseof fixing the stretching assistance member 50 in the vicinity of thecenter part of the one vapor deposition mask in at least part of aportion that is in contact with the surface of the one vapor depositionmask, the various modes described in FIG. 19 can be properly selectedand used. The modes described using FIG. 19 are modes effective in thecase where a distance from the position where the stretching assistancemember 50 and the vapor deposition mask 100 are fixed to each other tothe driving device 55 is long, that is, in the case where the area inwhich the stretching assistance member 50 and the surface of the vapordeposition mask come into contact with each other is large. Notably, inthe case where the distance from the position where the stretchingassistance member 50 and the vapor deposition mask 100 are fixed to eachother to the driving device 55 is short, that is, in the case where thearea in which the surface of the vapor deposition mask and thestretching assistance member come into contact with each other is small,not applying the preferable modes described above, the stretchingassistance member 50 and the vapor deposition mask 100 are sufficient tobe fixed to each other in at least part of a portion in which thestretching assistance member and one surface of the vapor depositionmask overlap with each other to pull the stretching assistance member.

The fixing position of one surface of the vapor deposition mask 100 andthe stretching assistance member 50 to each other is not limited at allbut the fixation can be performed at any position. In particular, in anembodiment of the present invention, differently from a gripping devicewhich grips the end part of the vapor deposition mask, the fixation canbe performed at any position where the stretching assistance member andthe vapor deposition mask overlap with each other, and the vapordeposition mask 100 and the stretching assistance member 50 can be fixedto each other at any position on the surface of the vapor depositionmask. Moreover, by properly configuring the material of the stretchingassistance member, the applying area of an adhesive agent or the like,and the like, the area and the like of a portion in which the stretchingassistance member 50 and the vapor deposition mask are fixed to eachother can be freely configured. The fixing position is described indetail for the first stretching step mentioned later, showing specificexamples.

Notably, in the frame fixing step mentioned later, since the vapordeposition mask is fixed to a frame 60 in the state of being stretched,the fixation of the stretching assistance member 50 and one surface ofthe vapor deposition mask to each other is preferably fixation at aposition where fixation of the vapor deposition mask to the frame is notdisturbed. As modes in which the fixation is performed at a positionwhere fixation of the frame and the vapor deposition mask to each other,a mode of fixing the stretching assistance member 50 onto one surface ofthe vapor deposition mask so as to prevent a scheduled position wherethe vapor deposition mask and the frame are fixed to each other, and amode of using a stretching assistance member 50 that does not absorblaser light can be cited.

As the former mode, the modes shown in FIGS. 9(a) to 9(e) and thesimilar mode can be cited. In FIGS. 9(a) and 9(b), one surface of thevapor deposition mask 100 and the stretching assistance members 50 arefixed to each other outside of the fixing scheduled positions to theframe. In FIGS. 9(c) to 9(e), parts of the stretching assistance members50 that correspond to the fixing scheduled positions to the frame areremoved. Removal of the stretching assistance member 50 may be performedby cutting out the stretching assistance member 50 as shown in FIGS.9(c) and 9(d), or may also be performed by boring the stretchingassistance member as shown in FIG. 9(e). The cutting-out shape or theboring shape for removing a part of the stretching assistance member 50is not limited to the modes shown in the figures but may be any shape.For example, while in FIG. 9(e), the stretching assistance member iscircularly bored, the boring may be performed into a polygonal shape oranother shape. The same holds true for the cutting-out shape. Moreover,while not shown, also in the case of stretching with a plurality ofstretching assistance members 50, a mode in which the stretchingassistance members 50 are fixed onto one surface of the vapor depositionmask so as to prevent the fixing scheduled position to the frame can betaken.

Typically, for the fixation of the frame and the vapor deposition maskto each other, a welding fixation method using laser light is used.Accordingly, as the latter mode, also in the case where the stretchingassistance member is positioned in a portion overlapping with thescheduled position where the vapor deposition mask and the frame arefixed to each other, by using a stretching assistance member 50 formedusing a transparent material, that is, a stretching assistance member 50that does not absorb laser light, the vapor deposition mask and theframe can be fixed to each other under irradiation with laser lightthrough the stretching assistance member 50. Moreover, since thestretching assistance member 50 formed using a transparent material isused, this mode is a preferable mode in that the vapor deposition maskand the frame can be fixed to each other while seeing the fixingscheduled position to the frame, without disturbing visibility of thescheduled position where the vapor deposition mask and the frame arefixed to each other.

The fixing strength of the vapor deposition mask 100 and the stretchingassistance member 50 to each other is not specially limited but issufficient to be properly configured depending on the tensile force andthe like in the occasion of pulling the stretching assistance member 50in the first stretching step mentioned later. Specifically, the fixationis sufficient to be performed at a strength to an extent where thestretching assistance member 50 does not drop off the vapor depositionmask 100 due to the tensile force in the occasion of pulling thestretching assistance member 50.

<First Stretching Step>

The first stretching step is a step of stretching the vapor depositionmask 100 fixed to the stretching assistance member 50 by pulling thestretching assistance member 50 fixed in the aforementioned stretchingassistance member fixing step in at least part of a portion overlappingwith the surface of the vapor deposition mask 100. The direction inwhich the stretching assistance member 50 is pulled is not limited butthe pulling may be performed in any direction such as the longitudinaldirection of the vapor deposition mask 100 (for example, the crosswisedirection shown in FIG. 1), the width direction thereof (for example,the lengthwise direction shown in FIG. 1), and another direction, forexample, an oblique direction. In particular, in an embodiment of thepresent invention, since the stretching assistance member 50 and thevapor deposition mask can be fixed to each other at any position on onesurface of the vapor deposition mask, the pulling can be easilyperformed in a direction other than the longitudinal direction and thewidth direction of the vapor deposition mask, the pulling in whichdirection has been difficult with a stretching device using a clamp orthe like which grips the end part of a conventional vapor depositionmask. Moreover, to “stretch a vapor deposition mask” stated in thespecification of the present application means to pull the stretchingassistance member 50 fixed to the vapor deposition mask and to exertexternal force (tensile force) in a direction in which the vapordeposition mask 100 fixed to the stretching assistance member 50 isextended. In other words, to “stretch a vapor deposition mask” means toexert external force (tensile force) in a direction in which the vapordeposition mask 100 fixed to the stretching assistance member 50 isextended using the stretching assistance member 50. The direction inwhich the vapor deposition mask is extended stated here is a conceptincluding not only a direction in which the opening 25 provided in theresin mask of the vapor deposition mask is extended but also a directionin which the opening 25 provided in the resin mask of the vapordeposition mask is shrunk. For example, in the modes shown in FIGS. 8(a)and 8(b), by pulling the stretching assistance members 50 outward of thevapor deposition mask 100, the openings (not-shown) provided in onescreen of the resin mask of the vapor deposition mask 100 are to beextended in the width direction. On the other hand, in the mode shown inFIG. 8(c), by pulling the stretching assistance members 50 outward ofthe vapor deposition mask, the openings (not-shown) provided in onescreen of the resin mask of the vapor deposition mask 100 are to beshrunk in the width direction. Moreover, as above, since adjustment canbe performed not only in the direction of extension but also in thedirection of shrinkage, positional adjustment can also be performed inthe state where the dimensions of the entirety of the vapor depositionmask, one screen, or the opening in the state of being stretched aremaintained. Moreover, by pulling the stretching assistance member 50,almost without changing the dimensions themselves of the opening 25, thepositional adjustment of the opening 25 can be performed and distortion,deflection or the like arising in the resin mask 20 can also berelieved.

As long as positioning of the vapor deposition mask can be performed, anangle formed by the surface of the vapor deposition mask 100 and theaxis of the direction in which the stretching assistance member ispulled is not specially designated, but in the first stretching step ina preferable mode, the stretching assistance member 50 fixed to thevapor deposition mask is pulled such that the angle formed by thesurface of the vapor deposition mask 100 and the axis of the directionin which the stretching assistance member is pulled is in a range ofabout 0°±89°, preferably about 0°±45°, still preferably about 0°±10°.According to this mode, distortion, deflection or the like can besuppressed from arising in the vapor deposition mask 100 fixed to thestretching assistance member 50 when the stretching assistance member 50is pulled. In other words, distortion, deflection or the like can besuppressed from arising in the vapor deposition mask after the firststretching step. Notably, the surface of the vapor deposition maskstated here means the surface of the vapor deposition mask correspondingto a region overlapping with the stretching assistance member 50 in planview of the vapor deposition mask 100.

Moreover, as shown in FIG. 8(b) or the like, in the case where aplurality of stretching assistance members 50 are fixed onto the surfaceof the vapor deposition mask 100 and the plurality of stretchingassistance members 50 are pulled, each stretching assistance member 50is preferably pulled within a range in which the angle formed by thesurface of the vapor deposition mask 100 and the axis of the directionin which the stretching assistance member is pulled is about 0°±89°,preferably about 0°±45°, still preferably about 0°±10°, and is about±10°, preferably about ±5° with respect to a reference angle. Notably,the reference angle stated here is any angle, for example, when thereference angle is set to be 30°, each stretching assistance member 50is preferably pulled such that the angle formed by the axis of thedirection in which the stretching assistance member 50 is pulled and thesurface of the vapor deposition mask becomes about 30°±10°, particularlyabout 30°±5°. As above, each stretching assistance member 50 is pulledat an angle within the aforementioned preferable range so as to be about±10°, preferably about ±5°, with respect to the reference angle, andthereby, the vapor deposition mask 100 can be stretched in the statewhere distortion, deflection or the like of the vapor deposition mask 50is being suppressed from arising. Notably, in the case where theplurality of stretching assistance members 50 are pulled at randomangles without the angle in the occasion when the stretching assistancemember 50 is pulled taken into consideration, distortion, deflection orthe like tends to easily arise in the vapor deposition mask in the stateof being stretched. Moreover, in the case where distortion, deflectionor the like arises in the vapor deposition mask fixed to the stretchingassistance member 50 in a stage before the first stretching step isperformed, it is preferable that with such distortion or deflectiontaken into consideration, angles at which the individual stretchingassistance members 50 are pulled be adjusted to fall within theaforementioned preferable range.

Next, showing specific examples, the first stretching step is describedwhile mentioning the fixing position of the vapor deposition mask 100and the stretching assistance member 50 to each other.

FIG. 10 presents elevation views showing the first stretching step of anembodiment. In FIG. 10(a), each one of stretching assistance members isfixed to each of the vicinities of opposite two sides of the vapordeposition mask (sides in the width direction in the mode shown in thefigure) on one surface of the vapor deposition mask, and by pulling thefixed stretching assistance members 50 outward of the vapor depositionmask (in the directions of the arrows in the figure), the vapordeposition mask fixed to the stretching assistance members 50 isstretched. In FIG. 10(b), each one of stretching assistance members 50is fixed to each of the vicinities of opposite two sides of the vapordeposition mask (sides in the longitudinal direction in the mode shownin the figure) on one surface of the vapor deposition mask, and bypulling the fixed stretching assistance members 50 outward of the vapordeposition mask (in the directions of the arrows in the figure), thevapor deposition mask fixed to the stretching assistance members 50 isstretched. FIG. 10(c) presents a mode having those in FIGS. 10(a) and10(b) combined. FIGS. 10(a) to 10(c) present modes in which the vapordeposition mask 100 fixed to the stretching assistance members 50 isstretched using the stretching assistance members 50 in place ofconventionally known clamps or the like.

Moreover, in place of the modes shown in FIG. 10, as shown in FIG. 11, aplurality of stretching assistance members 50 may be fixed to thevicinity of the end part of the vapor deposition mask on one surfacethereof to stretch the vapor deposition mask 100 fixed to the stretchingassistance members 50 using the stretching assistance members 50.According to the modes shown in FIG. 11, since the plurality ofstretching assistance members 50 are fixed to the vicinity of the endpart of the vapor deposition mask on one surface thereof, the vapordeposition mask can be stretched with more excellent precision. Forexample, in the modes shown in FIGS. 11(a) and 11(c), the stretchingassistance members 50 are fixed at both the position overlapping withone screen and the position not overlapping with one screen in the widthdirection of the vapor deposition mask 100 (vertical direction in thefigure), and by properly configuring tensile force values or pullingamounts in the occasion when the individual stretching assistancemembers are pulled, the vapor deposition mask can be stretched with moreexcellent precision. Notably, in FIG. 11(a), a plurality of stretchingassistance members 50 are fixed to the vicinities of the end parts ofopposite two sides of the vapor deposition mask (sides in the widthdirection in the mode shown in the figure) on one surface of the vapordeposition mask, and by pulling the stretching assistance members 50outward of the vapor deposition mask (in the directions of the arrows inthe figure), the vapor deposition mask is stretched. In FIG. 11(b), aplurality of stretching assistance members 50 are fixed to thevicinities of the end parts of opposite two sides of the vapordeposition mask (sides in the longitudinal direction in the mode shownin the figure) on one surface of the vapor deposition mask, and bypulling the stretching assistance members in the directions of thearrows in the figure, the vapor deposition mask is stretched. FIG. 11(c)presents a mode having those in FIGS. 11(a) and 11(b) combined.Moreover, a mode having the modes shown in FIG. 10 and FIG. 11 properlycombined can also be set. FIGS. 20(a) and 20(b) present modifications ofFIG. 11(a). In FIG. 20(a), the stretching assistance members 50 arefixed at positions overlapping with one screen in the width direction ofthe vapor deposition mask 100 (vertical direction in the figure). InFIG. 20(b), the stretching assistance members 50 are fixed at positionsnot overlapping with one screen in the width direction of the vapordeposition mask 100 (vertical direction in the figure). Themodifications shown in FIG. 20 may be modes having the modes shown inthe figures, for example, the mode shown in FIG. 11(c) combined.Notably, the modes shown in FIGS. 11(a) and 11(c) are preferable modesin that variations in the shape and the dimensions arising in theopenings 25 constituting one screen can be relieved with excellentprecision.

While in the modes shown in FIG. 10 and FIG. 11, each of the stretchingassistance members 50 is fixed to each of the vicinities of the endparts of opposite two sides of the vapor deposition mask on one surfaceof the vapor deposition mask 100, the stretching assistance member maybe fixed only to the vicinity of the end part of one side out of theopposite two sides of the vapor deposition mask on the one surface ofthe vapor deposition mask 100 to stretch the vapor deposition mask. Inother words, one side of the opposite two sides may be set as the fixedend to fix the stretching assistance member 50 to the vicinity of theend part of the other side and to pull the relevant stretchingassistance member. Moreover, one side of the opposite two sides may begripped by a gripping device such as a conventionally known clamp to fixthe stretching assistance member 50 on the one surface of the vapordeposition mask in the vicinity of the end part of the other side.

The first stretching step using the stretching assistance member 50 maybe performed in combination with a gripping device such as a clamp. FIG.12(a) is an elevation view showing a state where the end parts ofopposite two sides of the vapor deposition mask 100 (end parts in thelongitudinal direction in the mode shown in the figure) are retained bygripping devices 80 such as clamps, and driving devices joined to thegripping devices are operated to stretch the vapor deposition mask in afirst direction (longitudinal direction of the vapor deposition mask inthe mode shown in the figure). As the driving device joined to thegripping device, a motor, an air cylinder, an electric actuator and thelike can be cited. Notably, as shown in FIG. 12(a), in the case wherethe vapor deposition mask 100 is stretched only in the first direction(longitudinal direction of the vapor deposition mask in the mode shownin the figure), there can be a case where distortion or the like arisesin the vapor deposition mask due to shrinkage or the like of the vapordeposition mask, and the dimensions and the shape of the openingsprovided in the resin mask 20 of the vapor deposition mask vary.Notably, FIG. 12(a) shows a state where variations in shape anddimensions of the openings (not-shown) arranged in one screen arise dueto shrinkage or the like of the vapor deposition mask arising instretching the vapor deposition mask 100 in the first direction(longitudinal direction of the vapor deposition mask in the mode shownin the figure), and in the mode shown in the figure, the shape of onescreen is illustrated as a distorted shape in order to schematicallyshow the variations arising in shape and dimensions of the openings.Notably, the region which is rectangular one screen in FIG. 12(c) meansthat the variations in shape and dimensions of the openings arranged inthe one screen are relieved through the first stretching step.

In order to relieve variations in shape and dimensions of the openingswhich can arise in stretching the vapor deposition mask 100 in the firstdirection (longitudinal direction of the vapor deposition mask in themode shown in the figure), in the first stretching step, as shown inFIG. 12(b), after the vapor deposition mask is stretched using thegripping devices or the like in the first direction, the stretchingassistance members 50 fixed to one surface of the vapor deposition mask100 are pulled in a second direction different from the first direction(width direction of the vapor deposition mask in the mode shown in thefigure). As shown in FIG. 12(c), the variations in shape and dimensionsof the openings arising due to stretching in the first direction arerelieved. To stretch the vapor deposition mask using the stretchingassistance member 50 may be performed as above after the vapordeposition mask is stretched in the first direction using the grippingdevice, or may also be performed while stretching the vapor depositionmask in the first direction using the gripping device. The firstdirection stated here is not specially limited, but in the case wherethe vapor deposition mask is stretched using a conventionally knowngripping device or the like, the first direction is typically thelongitudinal direction or the width direction of the vapor depositionmask 100. Notably, the first direction may be any direction. In otherwords, the method for producing a frame-equipped vapor deposition maskof an embodiment may include a second stretching step of beforehandstretching the vapor deposition mask using a conventionally knowngripping device or the like before the first stretching step isperformed or simultaneously to the first stretching step.

Moreover, not using the gripping device such as a clamp, only using thestretching assistance member 50, the aforementioned stretching in thefirst direction and stretching in the second direction may be performed(refer to FIG. 11(c)). Moreover, the stretching in the first directionand the stretching in the second direction using the stretchingassistance member 50 may be simultaneously performed, or the stretchingin the second direction using the stretching assistance member 50 may beperformed after the stretching in the first direction using thestretching assistance member 50.

FIG. 15 and FIG. 16 are elevation views exemplarily showingframe-equipped vapor deposition masks of an embodiment of the presentinvention. A frame-equipped vapor deposition mask 200 shown in FIG. 15is constituted by fixing one vapor deposition mask 100 to the frame 60.A frame-equipped vapor deposition mask 200 in the mode shown in FIG. 16is constituted by arranging and fixing a plurality of vapor depositionmasks (four vapor deposition masks in the mode shown in the figure) tothe frame 60 in the longitudinal direction or the width direction(arranging and fixing them in the width direction in the mode shown inthe figure).

In the frame-equipped vapor deposition mask shown in FIG. 15, since onlyone vapor deposition mask is fixed to the frame, as shown in FIG. 13(a),the end part of the vapor deposition mask in the longitudinal directionand the end part thereof in the width direction can be easily gripped bygripping devices, which enables the vapor deposition mask to be easilystretched in both the longitudinal direction and the width direction.Notably, in FIG. 13(a), in partial regions of the vapor deposition mask(each inside of one screen designated by sign A in the figure),variations arise in the shape and the dimensions of the entirety or apart of the openings positioned in the partial regions. In order torelieve such variations in shape and dimensions of the openings, in FIG.13(b), the stretching assistance members 50 are fixed to the vicinity ofthe region where the variations of the openings arise (between onescreen designated by sign A and another one screen adjacent to the onescreen designated by the relevant sign A in the mode shown in thefigure) on one surface of the vapor deposition mask 100, and by pullingthe stretching assistance members 50, the vapor deposition mask fixed tothe stretching assistance members 50 is stretched to relieve thevariations of the openings. FIG. 13(a) is an elevation view exemplarilyshowing the vapor deposition mask in the occasion when the secondstretching step of stretching the vapor deposition mask using grippingdevices is performed before the first stretching step. FIG. 13(b) is anelevation view of the vapor deposition mask exemplarily showing thestate where the stretching assistance member fixing step is performedafter the second stretching step. FIG. 13(c) is an elevation viewexemplarily showing the vapor deposition mask from which variations ofthe openings are relieved by the first stretching step.

In the mode shown in FIG. 13(b), while one surface of the vapordeposition mask 100 and the stretching assistance member are fixed toeach other in the entirety or a part of a portion in which a portionbetween the one screens and the stretching assistance member 50 overlapwith each other on the one surface of the vapor deposition mask 100, theone surface of the vapor deposition mask 100 and the stretchingassistance member 50 can also be fixed to each other in the entirety ora part of a portion in which the region constituting one screen and thestretching assistance member 50 overlap with each other on the onesurface of the vapor deposition mask 100 (not shown). In other words,one surface of the vapor deposition mask 100 and the stretchingassistance member 50 can also be fixed to each other within one screen.Specifically, in the vapor deposition masks 100 shown in FIG. 2 to FIG.7 and the like, one surface of the vapor deposition mask 100 and thestretching assistance member 50 can also be fixed to each other in theentirety or a part of a portion in which a portion between theneighboring openings 25 of the plurality of openings 25 provided in onescreen and the stretching assistance member 50 overlap with each otheron the surface of the resin mask 20 side. In this case, by stretchingthe vicinity of the opening 25 provided in one screen, variations inshape and dimensions arising in the relevant opening 25 can beindividually relieved. In other words, the fixing position at which onesurface of the vapor deposition mask and the stretching assistancemember are fixed to each other can be properly configured in accordancewith a mode of stretching the entirety of the vapor deposition mask, amode of stretching the entirety of one screen, a mode of collectivelystretching a plurality of openings provided in one screen, a mode ofindividually stretching the opening 25 provided in one screen, or thesimilar mode, and the fixing position is not limited at all.

On the other hand, as shown in FIG. 16, in the mode in which a pluralityof vapor deposition masks are arranged and fixed to the frame 60 in thelongitudinal direction or the width direction of the vapor depositionmasks (arranged and fixed thereto in the width direction of the vapordeposition masks in the mode shown in the figure) to afford aframe-equipped vapor deposition mask (hereinafter sometimes referred toas frame-equipped multiple-attached vapor deposition mask), although theend parts of the vapor deposition mask in the longitudinal direction orthe width direction (end parts of the vapor deposition mask in thelongitudinal direction in the mode shown in the figure) can be easilygripped by gripping devices, the presence of a vapor deposition maskadjacent to one vapor deposition mask makes it difficult that the endparts in the adjacent direction (end parts of the vapor deposition maskin the width direction in the mode shown in the figure) are gripped bygripping devices. In other words, it is difficult to obtain theframe-equipped multiple-attached vapor deposition mask by stretching thevapor deposition mask using gripping devices in both the longitudinaldirection and the width direction.

As described above, in the method for producing a frame-equipped vapordeposition mask of an embodiment of the present invention, thestretching assistance member 50 is overlapped on one surface of thevapor deposition mask, the stretching assistance member 50 is fixed tothe one surface of the vapor deposition mask in at least part of aportion in which the one surface of the vapor deposition mask and thestretching assistance member 50 overlap with each other, and the vapordeposition mask fixed to the stretching assistance member is stretchedby using the stretching assistance member 50, in other words, by pullingthe fixed stretching assistance member 50. Accordingly, as illustratedin FIG. 14, even in the case where a gap between one vapor depositionmask 100 and another vapor deposition mask 100A adjacent to the onevapor deposition mask is absent or the gap is small, the stretchingassistance member 50 constituted by being fixed to one surface of theone vapor deposition mask can be pulled also in the direction on theside of the adjacent vapor deposition mask, and also in forming theframe-equipped multiple-attached vapor deposition mask, the vapordeposition mask can be stretched on two axes in the longitudinaldirection and the width direction thereof. In other words, according tothe producing method of an embodiment of the present invention, in thecase of setting a frame-equipped multiple-attached vapor depositionmask, the gap between the neighboring vapor deposition masks can be madeextremely small. Notably, in the mode shown in the figure, the vapordeposition masks other than the vapor deposition mask 100 areillustrated as being fixed to the frame at the places of signs Y in thefigure for convenience of explanation. Moreover, in FIG. 14(a), beforethe first stretching step, the second stretching step of stretching thevapor deposition mask 100 in the first direction (longitudinal directionof the vapor deposition mask in the mode shown in the figure) usinggripping devices is performed, and due to the second stretching step,variations in shape and dimensions arise in the openings constitutingone screen of the vapor deposition mask 100. By pulling the stretchingassistance members 50 in the second direction (on the neighboring vapordeposition masks direction side (in the width direction of the vapordeposition mask) in the mode shown in the figure) in the firststretching step, as shown in FIG. 14(b), the variations in shape anddimensions arising in the openings are to be relieved. Notably, theneighboring vapor deposition masks direction is not limited to thedirection perpendicular to the aforementioned first direction but mayhave a certain angle, for example, an angle of about 0°±45°, about0°±30° or about 0°±5° with respect to the axis of the relevantperpendicular direction.

<Frame Fixing Step>

As shown in FIG. 15 and FIG. 16, the frame fixing step is a step ofperforming overlapping with the frame 60 in which a through hole isformed such that the frame portion of the frame 60 and the metal mask 10of the vapor deposition mask which is in the state of being stretched inthe aforementioned first stretching step oppose each other, and fixingthe vapor deposition mask 100 in the state of being stretched in theaforementioned first stretching step to the frame 60. The fixation ofthe frame 60 and the vapor deposition mask 100 to each other isperformed with respect to a position where the frame 60 and the metalportion of the vapor deposition mask come into contact with each other,and the position is not specially limited. FIG. 15 is an elevation viewof the frame-equipped vapor deposition mask in which one vapordeposition mask is fixed to the frame 60 as seen from the resin maskside. FIG. 16 is an elevation view of the frame-equippedmultiple-attached vapor deposition mask 200 in which a plurality ofvapor deposition masks 100 are arranged and fixed to the frame in thelongitudinal direction or the width direction (arranged and fixedthereto in the width direction in the mode shown in the figure) as seenfrom the resin mask side.

(Frame)

The frame 60 is a substantially rectangular frame member and includes athrough hole for exposing the openings 25 provided in the resin mask 20of the vapor deposition mask 100 fixed in the final stage to the vapordeposition source side. The material of the frame is not speciallylimited but a metal material large in rigidity, for example, a SUS orinvar material or a ceramic material or the like can be used. Above all,a metal frame is preferable in view of being able to easily performwelding to the metal mask of the vapor deposition mask and being smallin influence of deformation and the like. The same holds true for thematerial of a reinforcement frame 65 below.

The thickness of the frame is not specially limited but is preferablyabout 10 mm to 30 mm in view of rigidity and the like. The widths of theinner circumferential end face of the opening of the frame and the outercircumferential end face of the frame are not specially limited as longas they are widths with which the frame and the metal mask of the vapordeposition mask can be fixed to each other, but, for example, widths ofabout 10 mm to 200 mm can be exemplarily cited.

Moreover, as shown in FIGS. 17(a) to 17(c), the frame 60 in whichreinforcement frames 65 and the like are provided in the region of thethrough hole may be used so as not to disturb exposure of the openings25 of the resin mask 20 constituting the vapor deposition mask 100. Toprovide the reinforcement frames 65 enables the frame 60 and the vapordeposition mask 100 to be fixed to each other using the relevantreinforcement frames 65. The frame 60 and the reinforcement frame 65 maybe constituted of the same material or may also be constituted ofdifferent materials.

Hereafter, the fixing method using the reinforcement frame 65 isexemplarily described.

For example, in the case where the frame-equipped vapor deposition maskin the mode shown in FIG. 16 is formed through the first stretching stepdescribed above, it is needed to fix the vapor deposition mask in thestate of being stretched after simultaneously performing stretching inthe first direction and in the second direction. This is because in thecase where the vapor deposition mask being stretched in the firstdirection is fixed to the frame 60 after stretching in the firstdirection (for example, in the longitudinal direction of the vapordeposition mask) and before stretching in the second direction differentfrom the first direction (for example, in the width direction of thevapor deposition mask), the frame 60 and the vapor deposition mask 100are completely fixed to each other in this stage, and even in the caseof stretching in the second direction different from the first directionin order to relieve variations in shape and dimensions of the openingswhich can arise due to stretching in the first direction, the vapordeposition mask 100 cannot be fixed to the frame 60 with the state ofbeing stretched in the second direction maintained.

On the other hand, in the case where the frame 60 in which thereinforcement frames 65 are provided is used, even after the vapordeposition mask is stretched in the first direction (for example, in thelongitudinal direction of the vapor deposition mask) and the vapordeposition mask 100 thus being stretched in the first direction is fixedto the body part of the frame 60, using the reinforcement frames 65, theframe 60 and the vapor deposition mask 100 can be fixed again to eachother (refer to FIG. 18). Specifically, even after stretching in thesecond direction different from the first direction in the firststretching step described above after stretching in the first directionis performed with respect to a part or the entirety of the plurality ofvapor deposition masks using a predetermined method and the vapordeposition mask 100 is fixed to the body part of the frame 60, the vapordeposition mask in the state of being stretched in the first stretchingstep can be fixed using the reinforcement frames 65. In other words,using the frame having reinforcement frames, once after theframe-equipped vapor deposition mask constituted by fixing the vapordeposition mask to the body part of the frame 60 is obtained, thestretching assistance members 50 are fixed in the vicinity of a regionin which variations in shape and dimensions of the openings arise, thestretching assistance members 50 are pulled, and thereby, the vapordeposition mask having been stretched can be fixed using thereinforcement frames 65. In other words, the vapor deposition mask fromwhich the variations in shape and dimensions of the openings arerelieved can be fixed using the reinforcement frames 65. In this method,the aforementioned stretching assistance member fixing step or firststretching step can also be applied as a method of fine adjustment ofvariations of the openings which can arise after the frame-equippedvapor deposition mask is obtained. The fine adjustment of variations ofthe openings may be performed by stretching in the direction ofexpanding the openings 25 or may also be performed by stretching andcontraction of the openings 25. Notably, the body part of the framestated here means portion different from the reinforcement frames 65,that is, the outer frame.

In the above, while the vapor deposition mask 100 is fixed to the bodypart of the frame 60 in the state where the vapor deposition mask 100 isbeing stretched in the first direction, and next, the fixed vapordeposition mask is further stretched in the second direction differentfrom the first direction using the first stretching step described aboveto fix the vapor deposition mask 100 to the reinforcement frames 65 ofthe frame 60, in place of this mode, the vapor deposition mask may befirst stretched using the first stretching step described above to fixthe vapor deposition mask 100 to the reinforcement frames 65 of theframe 60, and next, the vapor deposition mask may be fixed to the bodypart of the frame 60 by stretching the vapor deposition mask fixed tothe reinforcement frames 65 in a different direction from the directionof the previous stretching. Moreover, after stretching in the firstdirection and in the second direction, the vapor deposition mask may befixed to the body part of the frame 60 and the reinforcement frames 65.

Stretching in the first direction and stretching in the second directionmay be performed in the first stretching step or stretching in any oneof those may also be performed in the first stretching step. Forexample, stretching in the first direction may be performed in thesecond stretching step using the aforementioned gripping devices or thelike and stretching in the second direction may be performed in theaforementioned first stretching step. Moreover, stretching in the firstdirection may be performed in the aforementioned first stretching stepand stretching in the second direction may be performed in the secondstretching step. By way of example, the vapor deposition mask isstretched in the first direction in the second stretching step using theaforementioned gripping devices or the like in the stage beforeperforming the first stretching step, and after the second stretchingstep, the stretching assistance members are pulled in the firststretching step, and thereby, the vapor deposition mask fixed to thestretching assistance members is stretched in the second direction.Moreover, by way of another example, stretching in the first directionby the second stretching step using the gripping devices or the like andstretching in the second direction by the first stretching step aresimultaneously performed.

The frame 60 in which the reinforcement frames 65 are provided may beobtained, for example, by integrally forming the body part of the frame60 and the reinforcement frames 65 of the frame 60 or may also beobtained by fixing the reinforcement frames 65 to the frame that hasonly the body part. Moreover, the reinforcement frame 65 in a grid shapeas shown in FIG. 17(c) may be, for example, an integrated one obtainedby processing a metal plate or the like or may also be one obtained byincorporation of a plurality of reinforcement frames 65 in thelengthwise direction and in the crosswise direction. In the latter case,the incorporation is preferably performed such that when a plurality ofvapor deposition masks are arranged and disposed in the width directionof the frame 60 (crosswise direction in FIG. 17(c)), the reinforcementframes 65 extending in the direction (lengthwise direction in thefigure) perpendicular to the direction of the neighboring vapordeposition masks (crosswise direction in the figure) come into contactwith the vapor deposition masks, in other words, such that thereinforcement frames 65 extending in the direction perpendicular to thedirection of the neighboring vapor deposition masks are positioned onthe upper side. Notably, in FIG. 17(c), the incorporation is performedsuch that the reinforcement frames extending in the direction of theneighboring vapor deposition masks are positioned on the upper side ofthe reinforcement frames 65 extending in the direction perpendicular tothe direction of the neighboring vapor deposition masks. Moreover, thereinforcement frames 65 are not limited to the mode shown in the figurebut may be in the mode in which a plurality of reinforcement frames 65extending in random directions are combined.

Moreover, the aforementioned first stretching step can also be performedin the state where the vapor deposition mask 100 is tentatively fixed tothe body part of the frame 60 or the reinforcement frames 65. Thetentative fixation can be performed by disposing a member havingmagnetism such, for example, as a magnetic plate and a magnet sheet onthe surface, of the frame 60, on the side that does not come intocontact with the vapor deposition mask 100 or the surface, of the vapordeposition mask 100, on the side that does not come into contact withthe frame, and causing the vapor deposition mask 100 and the body partof the frame 60 or the reinforcement frames 65 to attract each other.For example, the frame-equipped vapor deposition mask can also beobtained by tentatively fixing the vapor deposition mask in the state ofbeing stretched in the first direction after stretching in the firstdirection toward the body part of the frame 60 or the reinforcementframes 65, stretching the vapor deposition mask in the state of beingtentatively fixed in the first stretching step, and welding and fixingthe frame 60 and the vapor deposition mask to each other after the firststretching step. Moreover, in the case where the stretching assistancemembers 50 constituted of a material having magnetism or the stretchingassistance members 50 obtained by combining the material havingmagnetism and another material, for example, a material havingself-adsorption, without using a separate magnetic plate, magnet sheetor the like, using the magnetism of the stretching assistance members 50themselves, the vapor deposition mask 100 can also be stretched by thestretching assistance members 50 while tentatively fixing thereinforcement frames 65 of the frame 60 and the vapor deposition mask100 to each other. In other words, the stretching assistance members 50in this case serve both to tentatively fix the vapor deposition mask andthe frame to each other and to stretch the vapor deposition mask. Thetentative fixation can suppress positional displacement and the likethat can arise due to stretching the vapor deposition mask, whichenables the vapor deposition mask to be stretched with more excellentprecision. Moreover, in place of the methods exemplarily presentedabove, the vapor deposition mask in the state of being stretched in thefirst direction after stretching in the first direction can also bewelded and fixed to the body part of the frame 60, next, the vapordeposition mask welded and fixed to the body part of the frame 60 istentatively fixed to the reinforcement frames 65, and after that, thefirst stretching step can also be performed with respect to the vapordeposition mask that has undergone the welding and fixation to the bodypart of the frame 60 and the tentative fixation to the assistance frames65. Also with this method, the tentative fixation can suppresspositional displacement and the like that can arise due to stretchingthe vapor deposition mask, which enables the vapor deposition mask to bestretched with more excellent precision.

The width of each reinforcement frame 65 in the case of setting thereinforcement frames 65 in a grid shape in the mode shown in FIG. 17(c)is not specially limited but the widths of all of the reinforcementframes 65 may have the same dimension or the width may also be changedfor the individual reinforcement frames 65. Notably, in order toincrease the number of vapor deposition masks assigned to the frame whenthe plurality of vapor deposition masks are arranged and disposed, it isneeded for the distance between the neighboring vapor deposition masksto be made small. When the distance between the neighboring vapordeposition masks is made small, accordingly to this, it is also neededfor the widths of the reinforcement frames 65 extending in the directionperpendicular to the direction of the neighboring vapor deposition masksto be made small. Now, when the width of the reinforcement frame 65 ismade small, the rigidity of the reinforcement frame 65 extending in thedirection perpendicular to the direction of the neighboring vapordeposition masks decreases and deformation and the like tend to arisewhen the vapor deposition mask is fixed to the reinforcement frames 65extending in the direction perpendicular to the direction of theneighboring vapor deposition masks.

With this point taken into consideration, when the width of thereinforcement frame 65 extending in the direction perpendicular to thedirection of the neighboring vapor deposition masks is made small, it ispreferable that the width of the reinforcement frame 65 extending in thedirection of the neighboring vapor deposition masks is made larger thanthis width. To increase the widths of the reinforcement frames extendingin the direction of the neighboring vapor deposition masks can enhancethe rigidity of the reinforcement frames 65 as a whole, which cansuppress deformation and the like from arising in the reinforcementframes 65 when the vapor deposition mask is fixed to the reinforcementframes 65. In other words, in reinforcement frames in a preferable mode,the width of the reinforcement frame 65 extending in the direction ofthe neighboring vapor deposition masks is larger than the width of thereinforcement frame 65 extending in the direction perpendicular to thedirection of the neighboring vapor deposition masks. By way of example,the width of the reinforcement frame 65 extending in the directionperpendicular to the direction of the neighboring vapor deposition masksis about 0.5 mm to 50 mm, and the width of the reinforcement frame 65extending in the direction of the neighboring vapor deposition masks isabout 0.5 mm to 50 mm. The reinforcement frames 65 in a preferable modesatisfy the relation that the width of the reinforcement frame 65extending in the direction perpendicular to the direction of theneighboring vapor deposition masks and the width of the reinforcementframe 65 extending in the direction of the neighboring vapor depositionmasks are within the ranges of the widths exemplarily presented above,and that the width of the reinforcement frame 65 extending in thedirection of the neighboring vapor deposition masks is larger than thewidth of the reinforcement frame 65 extending in the directionperpendicular to the direction of the neighboring vapor depositionmasks. The thickness of the reinforcement frame 65 by way of example isabout 0.01 mm to 30 mm.

Moreover, a groove is formed on the body part of the frame that overlapswith the reinforcement frame 65, the reinforcement frame 65 is fitted tothe groove, and thereby, a planar position of the body part to thereinforcement frame 60 can be matched. Moreover, in the case of settingthe reinforcement frames 65 in a grid shape by incorporation of theplurality of reinforcement frames 65, grooves or the like can also beproperly provided on the reinforcement frames 65 such that planarpositions of the individual reinforcement frames 65 are the same.

The fixation method is not specially limited but the fixation can beperformed using various conventionally known welding methods such aslaser welding, arc welding, electric resistance welding and electronbeam welding methods, an adhesive agent, screw fastening, and the like.

Then, after the aforementioned frame fixing step is ended, thestretching assistance members 50 fixed onto one surface of the vapordeposition mask 100 are removed from the vapor deposition mask, andthereby, the frame-equipped vapor deposition mask constituted by fixingthe vapor deposition mask to the frame is obtained.

<<Method for Stretching Vapor Deposition Mask>>

Next, a method for stretching a vapor deposition mask of an embodimentof the present invention is described. A method for stretching a vapordeposition mask of an embodiment of the present invention including ametal mask in which a slit is formed and a resin mask in which anopening corresponding to a pattern to be produced by vapor deposition isformed at a position overlapping with the slit, the metal mask and theresin mask being stacked, the method including: a stretching assistancemember fixing step of overlapping a stretching assistance member on onesurface of the vapor deposition mask and fixing the stretchingassistance member to the vapor deposition mask in at least part of aportion in which the one surface of the vapor deposition mask and thestretching assistance member overlap with each other; and a firststretching step of stretching the vapor deposition mask fixed to thestretching assistance member by pulling the stretching assistance memberfixed to the vapor deposition mask. According to the method forstretching a vapor deposition mask of an embodiment of the presentinvention, the vapor deposition mask can be stretched in a simplemethod, and the vapor deposition mask fixed to the stretching assistancemembers can be stretched in the direction on the side of another vapordeposition mask even in the situation where the other vapor depositionmask is adjacent to the relevant vapor deposition mask.

Moreover, in the method for stretching a vapor deposition mask of anembodiment, the aforementioned first stretching step is performed afterbeforehand stretching the vapor deposition mask in the first direction,for example, the longitudinal direction or the width direction of thevapor deposition mask using gripping devices or the like, and in thefirst stretching step, the stretching assistance members are pulled inthe second direction different from the aforementioned first directionof the beforehand stretching, for example, the direction perpendicularto the first direction. In other words, before the first stretchingstep, a second stretching step of stretching the vapor deposition maskin the first direction using gripping devices or the like may be furtherincluded. Moreover, the first stretching step and the second stretchingstep may be simultaneously performed.

To the stretching assistance member fixing step and the first stretchingstep, the stretching assistance member fixing step and the firststretching step which have been described for the aforementionedframe-equipped vapor deposition mask of an embodiment of the presentinvention can be applied as they are, and their detailed description isomitted here.

<<Method for Producing Organic Semiconductor Element>>

Next, a method for producing an organic semiconductor element of anembodiment of the present invention is described. A method for producingan organic semiconductor element of an embodiment of the presentinvention includes a step of forming a vapor deposition pattern in avapor deposition method using a frame-equipped vapor deposition mask,wherein in a step of producing the organic semiconductor element, theframe-equipped vapor deposition mask of an embodiment produced in theaforementioned producing method of an embodiment of the presentinvention is used.

The method for producing an organic semiconductor element of anembodiment including the step of forming a vapor deposition pattern in avapor deposition method using the frame-equipped vapor deposition maskincludes an electrode forming step, an organic layer forming step, acounter electrode forming step, a sealing layer forming step and thelike in which electrodes are formed on a substrate, and in any of thesteps, a vapor deposition pattern is formed on the substrate in a vapordeposition method using the frame-equipped vapor deposition mask. Forexample, in the case where the vapor deposition method using theframe-equipped vapor deposition mask is applied to each oflight-emitting layer forming steps for colors of R, G and B in anorganic EL device, vapor deposition patterns are formed for thelight-emitting layers for the colors on the substrate. Notably, themethod for producing an organic semiconductor element of an embodimentof the present invention is not limited to these steps but can beapplied to any steps in conventionally known production of an organicsemiconductor element using a vapor deposition method.

The method for producing an organic semiconductor element of anembodiment of the present invention is characterized in that theaforementioned frame-equipped vapor deposition mask used in steps offorming vapor deposition patterns is the frame-equipped vapor depositionmask of an embodiment described above which is produced in the producingmethod of an embodiment of the present invention.

For the frame-equipped vapor deposition mask, one produced as theframe-equipped vapor deposition mask of an embodiment of the presentinvention described above can be used as it is, and its detaileddescription is omitted here. According to the method for producing anorganic semiconductor element using the frame-equipped vapor depositionmask as the frame-equipped vapor deposition mask of an embodiment of thepresent invention described above, since the frame-equipped vapordeposition mask in which variations in shape and dimensions of theopenings of the vapor deposition mask are suppressed can be used, anorganic semiconductor element having a pattern with high definition canbe formed. As organic semiconductor elements produced in the producingmethod of an embodiment of the present invention, for example, organiclayers, light-emitting layers, cathode electrodes and the like oforganic EL elements can be cited. In particular, the method forproducing an organic semiconductor element of an embodiment of thepresent invention can be preferably used for production of R, G and Blight-emitting layers of organic EL elements which require patternprecision with high definition.

<<Stretching Apparatus>>

Next, a stretching apparatus of an embodiment of the present inventionis described. A stretching apparatus of an embodiment of the presentinvention for stretching a vapor deposition mask including a metal maskin which a slit is formed and a resin mask in which an openingcorresponding to a pattern to be produced by vapor deposition is formedat a position overlapping with the slit, the metal mask and the resinmask being stacked, the apparatus including: a stretching assistancemember; and a driving device for pulling the stretching assistancemember, wherein the stretching assistance member is capable of beingfixed in at least part of a portion overlapping with one surface of thevapor deposition mask when overlapped with the one surface of the vapordeposition mask.

As the stretching assistance member and the driving device whichconstitute the stretching apparatus, the stretching assistance member 50and the driving device 55 described for the aforementioned method forstretching the frame-equipped vapor deposition mask of an embodiment canbe properly selected and used, and their detailed description is omittedhere. According to the stretching apparatus of an embodiment of thepresent invention, the vapor deposition mask can be stretched byoverlapping the stretching assistance member on one surface of the vapordeposition mask, fixing the vapor deposition mask and the stretchingassistance member to each other in at least part of a portionoverlapping with the one surface of the vapor deposition mask, andoperating the driving device joined to the stretching assistance member.

An embodiment of the present invention in the various modes describedabove is particularly preferable in the case where as the vapordeposition mask which is a target of stretching, a vapor deposition maskincluding a metal mask in which a slit is formed and a resin mask inwhich an opening corresponding to a pattern to be produced by vapordeposition is formed at a position overlapping with the slit, the metalmask and the resin mask being stacked, is used. This is becausevariations in dimensions and position of the openings corresponding to apattern to be produced by vapor deposition tend to arise in the casewhere a vapor deposition mask obtained by stacking two masks havingdifferent properties, in other words, a resin mask and a metal mask isstretched in a predetermined method, for example, of stretching usinggripping devices or the like, as compared with the case where a vapordeposition mask constituted only of a metal mask and a vapor depositionmask constituted only of a resin mask are stretched. In an embodiment ofthe present invention in the various modes, even when variations indimensions and position of the openings arise, such variations can beeasily relieved by stretching the vapor deposition mask using thestretching assistance members 50.

<<Modifications>>

In the method for stretching a vapor deposition mask, the method forproducing a frame-equipped vapor deposition mask, the method forproducing an organic semiconductor element, and the stretching apparatusof modifications, as the vapor deposition mask which is a target ofstretching, vapor deposition masks different from the aforementionedvapor deposition mask including a metal mask in which a slit is formedand a resin mask in which an opening corresponding to a pattern to beproduced by vapor deposition is formed at a position overlapping withthe slit, the metal mask and the resin mask being stacked, (hereinafterreferred to as different vapor deposition mask) are used, and thedifferent vapor deposition masks are stretched using the stretchingassistance members 50. As the aforementioned different vapor depositionmasks, a vapor deposition mask constituted only of a metal maskconstituted of a metal material, a vapor deposition mask constitutedonly of a resin mask constituted of a resin material, or a vapordeposition mask constituted of a material other than metals and resinmaterials can be cited. Notably, each of the embodiments in anembodiment of the present invention and the modifications are differentonly in the vapor deposition mask which is a target of stretching andare the same in the others. Among the vapor deposition masks of themodifications, the stretching method using the stretching assistancemembers 50 can be preferably used for the vapor deposition maskconstituted only of a resin mask constituted of a resin material, ascompared with the vapor deposition mask constituted of a metal material,in view of variations in shape and dimensions of the openingscorresponding to a pattern to be produced by vapor deposition tending toarise when the vapor deposition mask is stretched using gripping devicesor the like. Moreover, also for the vapor deposition mask constitutedonly of a metal mask having a portion whose thickness is not more thanabout 20 μm, the stretching method using the stretching assistancemembers 50 can be preferably used similarly to the aforementioned vapordeposition mask constituted only of a resin mask, in view of variationsin shape and dimensions of the openings corresponding to a pattern to beproduced by vapor deposition tending to arise when the vapor depositionmask is stretched using gripping devices or the like.

REFERENCE SIGNS LIST

-   10 Metal mask-   15 Slit-   20 Resin mask-   25 Opening-   50 Stretching assistance member-   50A Stretching assistance member body part-   50B Stretching assistance member extension part-   55 Driving device-   60 Frame-   65 Reinforcement frame-   100 Vapor deposition mask-   200 Frame-equipped vapor deposition mask

The invention claimed is:
 1. A method for stretching a vapor depositionmask including a metal mask having a slit and a resin mask having anopening corresponding to a pattern to be produced by vapor deposition ata position overlapping with the slit, the metal mask and the resin maskbeing stacked, the method comprising: a stretching assistance memberfixing step of overlapping a stretching assistance member on one surfaceof the vapor deposition mask and fixing the stretching assistance memberto the vapor deposition mask in at least part of a portion in which theone surface of the vapor deposition mask and the stretching assistancemember overlap with each other; and a first stretching step ofstretching the vapor deposition mask fixed to the stretching assistancemember by pulling the stretching assistance member fixed to the vapordeposition mask.
 2. The method for stretching a vapor deposition maskaccording to claim 1, further comprising a second stretching step ofstretching the vapor deposition mask in a first direction before thefirst stretching step, wherein in the first stretching step, the vapordeposition mask fixed to the stretching assistance member is stretchedin a second direction different from the first direction by pulling thestretching assistance member fixed to the vapor deposition mask.
 3. Amethod for producing a frame-equipped vapor deposition mask, comprising:a preparing step of preparing a vapor deposition mask including a metalmask having a slit and a resin mask having an opening corresponding to apattern to be produced by vapor deposition at a position overlappingwith the slit, the metal mask and the resin mask being stacked; astretching assistance member fixing step of overlapping a stretchingassistance member on one surface of the vapor deposition mask and fixingthe stretching assistance member to the vapor deposition mask in atleast part of a portion in which the one surface of the vapor depositionmask and the stretching assistance member overlap with each other; afirst stretching step of stretching the vapor deposition mask fixed tothe stretching assistance member by pulling the stretching assistancemember fixed to the vapor deposition mask; and a frame fixing step offixing the vapor deposition mask in a state of being stretched in thefirst stretching step to a frame in which a through hole is formed. 4.The method for producing a frame-equipped vapor deposition maskaccording to claim 3, further comprising a second stretching step ofstretching the vapor deposition mask in a first direction before thefirst stretching step, wherein in the first stretching step, the vapordeposition mask fixed to the stretching assistance member is stretchedin a second direction different from the first direction by pulling thestretching assistance member fixed to the vapor deposition mask.
 5. Themethod for producing a frame-equipped vapor deposition mask according toclaim 3, wherein the frame-equipped vapor deposition mask is aframe-equipped vapor deposition mask constituted by arranging and fixinga plurality of the vapor deposition masks to the frame, in a stage forproducing the frame-equipped vapor deposition mask, at least one vapordeposition mask of the plurality of vapor deposition masks is fixed tothe frame through the stretching assistance member fixing step, thefirst stretching step and the frame fixing step, and in the firststretching step, by pulling the stretching assistance member fixed tothe one vapor deposition mask, the one vapor deposition mask fixed tothe stretching assistance member is stretched in a direction toward avapor deposition mask adjacent to the one vapor deposition mask.
 6. Themethod for producing a frame-equipped vapor deposition mask according toclaim 5, further comprising a second stretching step of stretching theone vapor deposition mask in a direction different from the directiontoward the adjacent vapor deposition mask before the first stretchingstep is performed.
 7. A method for producing an organic semiconductorelement, comprising a step of forming a vapor deposition pattern on avapor deposition target using a frame-equipped vapor deposition mask inwhich a vapor deposition mask is fixed to a frame, wherein in the stepof forming the vapor deposition pattern, the vapor deposition mask fixedto the frame is a frame-equipped vapor deposition mask produced throughthe steps including: a step of preparing the vapor deposition maskincluding a metal mask having a plurality of slits and a resin maskhaving openings corresponding to a pattern to be produced by vapordeposition at a position overlapping with the slits, the metal mask andthe resin mask being stacked; a stretching assistance member fixing stepof overlapping a stretching assistance member on one surface of thevapor deposition mask and fixing the stretching assistance member to thevapor deposition mask in at least part of a portion in which the onesurface of the vapor deposition mask and the stretching assistancemember overlap with each other; a first stretching step of stretchingthe vapor deposition mask fixed to the stretching assistance member bypulling the stretching assistance member fixed to the vapor depositionmask; and a frame fixing step of fixing the vapor deposition mask in astate of being stretched in the first stretching step to the frame inwhich a through hole is formed.
 8. A stretching apparatus for stretchinga vapor deposition mask including a metal mask having a slit and a resinmask having an opening corresponding to a pattern to be produced byvapor deposition at a position overlapping with the slit, the metal maskand the resin mask being stacked, the apparatus comprising: a stretchingassistance member; and a driving device for pulling the stretchingassistance member, wherein the stretching assistance member is capableof being fixed in at least part of a portion overlapping with onesurface of the vapor deposition mask when overlapped with the onesurface of the vapor deposition mask.